AT83C24 ATMEL Corporation, AT83C24 Datasheet - Page 29

• Manufacturer Part Number: AT83C24
• Description: Smart Card Reader Interface with Power Management
• Manufacturer: ATMEL Corporation

Electrical Characteristics
Absolute Maximum Ratings
AC/DC Parameters
Table 17. Core (VCC)
Table 18. Host Interface (I/O, C4, C8, CLK, A2, A1, A0, CMDVCC, PRES/INT)
4234E–SCR–09/04
Ambient Temperature Under Bias: .....................-40 C to 85 C
Storage Temperature: ................................... -65 C to +150 C
Voltage on VCC: ........................................ V
Voltage on SCIB pins (***): ......... CVSS -0.5V to CVCC + 0.5V
Voltage on host interface pins:.......VSS -0.5V to EVCC + 0.5V
Voltage on other pins: ...................... VSS -0.5V to VCC + 0.5V
Power Dissipation: .......................................................... 1.5W
Thermal resistor of QFN pack-
age..(**)............................35°C/W
Thermal resistor of SO package.................................48°C/W
Symbol
Symbol
t
V
V
rise,
V
PFDM
V
PFDP
IH
IL
t
fall
Input Low-voltage
Input High Voltage
Power fail high level threshold
Power fail low level threshold
V
DD
rise and fall time
Parameter
Parameter
(**) Exposed die attached pad must be soldered to ground
Thermal resistor are measured on multilayer PCB with 0 m/s air flow.
(***) including shortages between any groups of smart card pins.
EVCC connected to host power supply: from 1.6V to 5.5V.
T
CLASS A card supplied with CVCC = 4.75 to 5.25V for AT83C24NDS
CLASS A card supplied with CVCC = 4.6 to 5.25V for AT83C24
CLASS B card supplied with CVCC = 2.8V to 3.2V
CLASS C card supplied with CVCC = 1.68V to 1.92V
A
*
= -40 C to +85 C; V
SS
-0.5V to +6.0V
0.7 x EVCC
Min
-0.5
Min
2.25
1 s
SS
2.4
= 0V; V
*NOTICE:
CC
Typ
= 3V to 5.5V.
Typ
2.35
2.5
Stresses at or above those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions above those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions may affect device reliability.
Power Dissipation value is based on the maxi-
mum allowable die temperature and the thermal
resistance of the package.
0.25 x EVCC
0.3 x EVCC
EVCC + 0.5
Max
Max
600s
2.45
2.6
Unit
Unit
V
V
V
V
EVCC from 2.7V to VCC
EVCC from 1.6 to 2.7V
EAUTO=0
EAUTO=1
EVCC from 1.6V to VCC
Not tested.
Test Conditions
AT83C24
Test Conditions
29