DSPIC30F6010A MICROCHIP [Microchip Technology], DSPIC30F6010A Datasheet - Page 220

no-image

DSPIC30F6010A

Manufacturer Part Number
DSPIC30F6010A
Description
High-Performance, 16-bit Digital Signal Controllers
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F6010A-20E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6010A-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6010A-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F6010A-20I/PF
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F6010A-20I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6010A-20I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F6010A-30I/
Manufacturer:
TI
Quantity:
7 880
Part Number:
DSPIC30F6010A-30I/PF
Manufacturer:
AD
Quantity:
2 100
Part Number:
DSPIC30F6010A-30I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6010A-30I/PF
0
Part Number:
DSPIC30F6010A-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6010A-30I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F6010A-30I/PT
0
dsPIC30F6010A/6015
80-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS70150E-page 220
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
Dimension Limits
E1
φ
NOTE 2
Units
L
A2
A1
E1
D1
L1
N
A
E
D
α
e
L
φ
c
b
β
E
A1
A
MIN
0.95
0.05
0.45
0.09
0.17
11°
11°
MILLIMETERS
L1
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
12°
12°
80
Microchip Technology Drawing C04-092B
© 2011 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
A2
α

Related parts for DSPIC30F6010A