UJA1061TW PHILIPS [NXP Semiconductors], UJA1061TW Datasheet - Page 77

• Manufacturer Part Number: UJA1061TW
• Description: Low speed CAN/LIN system basis chip
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
10 PACKAGE OUTLINE
2004 Mar 22
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
Low speed CAN/LIN system basis chip
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
JEDEC
11.1
10.9
D
(1)
REFERENCES
0
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
77
2.5
E h
3.6
3.4
w
c
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
detail X
EUROPEAN
0.2
v
L
L
0.1
p
w
Objective specification
(A 3 )
0.1
y
A
ISSUE DATE
UJA1061
99-03-04
03-04-07
0.78
0.48
X
Z
SOT549-1
A
v
M
8
0
o
o
A