UJA1061TW PHILIPS [NXP Semiconductors], UJA1061TW Datasheet - Page 2

• Manufacturer Part Number: UJA1061TW
• Description: Low speed CAN/LIN system basis chip
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
CONTENTS
1
1.1
1.2
1.3
1.4
1.5
2
3
4
5
6
6.1
6.2
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
6.3
6.4
6.4.1
6.4.2
6.4.3
6.4.4
6.5
6.5.1
6.5.2
6.6
6.6.1
6.6.2
6.6.3
6.6.4
6.7
6.7.1
6.7.2
6.7.3
6.8
6.8.1
6.8.2
2004 Mar 22
Low speed CAN/LIN system basis chip
FEATURES
General
System features
Fail-safe features
CAN physical layer
LIN physical layer
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Introduction
Fail-safe system controller
Fail-safe mode
Start-up mode
Restart mode
Normal mode
Standby mode
Sleep mode
Flash mode
On-chip oscillator
Watchdog
Watchdog start-up behaviour
Watchdog window behaviour
Watchdog time-out behaviour
Watchdog OFF behaviour
System reset
System reset pin RSTN
Enable output pin EN
Power supplies
Supported battery systems
Static and dynamic battery monitoring
Voltage regulators V1 and V2
Switched battery output (V3)
CAN transceiver
Mode control
Termination control
Bus, RXD and TXD failure detection
LIN transceiver
Mode control
Bus and TXDL failure detection
2
6.9
6.10
6.11
6.12
6.13
6.14
6.14.1
6.14.2
6.14.3
6.14.4
6.14.5
6.14.6
6.14.7
6.14.8
6.14.9
6.14.10
6.14.11
6.14.12
6.14.13
6.14.14
6.15
6.16
6.16.1
6.16.2
7
8
9
10
11
11.1
11.2
11.3
11.4
11.5
12
13
14
Inhibit output (pin INH)
Wake-up input (pin WAKE)
Temperature protection
SPI interface
SPI register mapping
Register overview
Mode register
System status register
System diagnosis register
Interrupt enable register
Interrupt Enable Feedback register
Interrupt register
System configuration register
System Configuration Feedback register
Physical Layer Control register
Physical layer control feedback register
Special Mode register
General Purpose registers
General Purpose Feedback registers
Register configurations at reset
Test modes
Software development mode
Forced Normal mode
LIMITING VALUES
DC CHARACTERISTICS
AC CHARACTERISTICS
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
Interrupt output
Objective specification
UJA1061