MC68HC705C Motorola, MC68HC705C Datasheet - Page 189

• Manufacturer Part Number: MC68HC705C
• Description: HCMOS Microcontroller Unit
• Manufacturer: Motorola

14.1 Contents
14.2 Introduction
MC68HC705C8A — Rev. 2.0
MOTOROLA
Technical Data — MC68HC705C8A
14.2
14.3
14.4
14.5
14.6
14.7
14.8
Package dimensions available at the time of this publication for the
MC68HC705C8A are provided in this section. The packages are:
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40-pin plastic dual in-line package (PDIP)
40-pin ceramic dual-in-line package (cerdip)
44-lead plastic-leaded chip carrier (PLCC)
44-lead ceramic-leaded chip carrier (CLCC)
44-pin quad flat pack (QFP)
42-pin shrink dual in-line package (SDIP)
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .189
40-Pin Plastic Dual In-Line Package (PDIP). . . . . . . . . . . . . .190
40-Pin Ceramic Dual In-Line Package (Cerdip) . . . . . . . . . . .191
44-Lead Plastic-Leaded Chip Carrier (PLCC) . . . . . . . . . . . .192
44-Lead Ceramic-Leaded Chip Carrier (CLCC) . . . . . . . . . . .193
44-Pin Quad Flat Pack (QFP). . . . . . . . . . . . . . . . . . . . . . . . .194
42-Pin Shrink Dual In-Line Package (SDIP) . . . . . . . . . . . . . .195
Section 14. Mechanical Specifications
Mechanical Specifications
Technical Data
189