le79128 Zarlink Semiconductor, le79128 Datasheet - Page 49

• Manufacturer Part Number: le79128
• Description: Next Generation Voiceedge™ Control Processor Next Generation Carrier Chipset Ngcc
• Manufacturer: Zarlink Semiconductor

144-Pin LBGA
Note:
Packages may have mold tooling markings on the surface. These markings have no impact on the form, fit or function of the
device. Markings will vary with the mold tool used in manufacturing.
NOTES:
1
2
3
Symbol
D1
A1
A2
A3
E1
A
D
E
Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
Datum Z is defined by the spherical crowns of the solder balls.
Parallelism measurement shall exclude any effect of mark on top surface of package.
b
e
UNIT
MM
1.25
0.27
0.40
Min
0.32 REF
0.80 REF
144 LBGA
13 BSC
13 BSC
11 BSC
11 BSC
1 BSC
DIMENSION AND
TOLERANCES
ASME_Y14.5M
Microsemi Corporation - CMPG
Max
1.60
0.47
0.60
Le79128
49
REFERENCE DOCUMENT
98ASH70694A-A
Preliminary Data Sheet