mpc8555e Freescale Semiconductor, Inc, mpc8555e Datasheet - Page 73

• Manufacturer Part Number: mpc8555e
• Description: Mpc8555e Powerquicc Iii Processor With Integrated Security
• Manufacturer: Freescale Semiconductor, Inc

the heat sink should be slowly removed. Heating the heat sink to 40–50
interface material and make the removal easier. The use of an adhesive for heat sink attach is not
recommended.
The system board designer can choose between several types of thermal interface. There are several
commercially-available thermal interfaces provided by the following vendors:
Freescale Semiconductor
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
18930 West 78
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
1.5
0.5
2
1
0
Figure 46. Thermal Performance of Select Thermal Interface Materials
0
th
St.
10
20
Contact Pressure (psi)
30
40
800-248-2481
781-935-4850
888-642-7674
800-347-4572
50
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
60
°
C with an air gun can soften the
70
80
Thermal
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