mpc8555e Freescale Semiconductor, Inc, mpc8555e Datasheet - Page 57

• Manufacturer Part Number: mpc8555e
• Description: Mpc8555e Powerquicc Iii Processor With Integrated Security
• Manufacturer: Freescale Semiconductor, Inc

14.2
Figure 42
package.
Notes:
Freescale Semiconductor
1.
2.
3.
4.
5.
6.
7.
All dimensions are in millimeters.
Dimensions and tolerances per ASME Y14.5M-1994.
Maximum solder ball diameter measured parallel to datum A.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
Capacitors may not be present on all devices.
Caution must be taken not to short capacitors or exposed metal capacitor pads on package top.
The socket lid must always be oriented to A1.
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
Mechanical Dimensions of the FC-PBGA
Figure 42. Mechanical Dimensions and Bottom Surface Nomenclature of the FC-PBGA
the mechanical dimensions and bottom surface nomenclature of the MPC8555E 783 FC-PBGA
Package and Pin Listings
57