mpc8555e Freescale Semiconductor, Inc, mpc8555e Datasheet - Page 13

• Manufacturer Part Number: mpc8555e
• Description: Mpc8555e Powerquicc Iii Processor With Integrated Security
• Manufacturer: Freescale Semiconductor, Inc

1.
2.
3.
4.
5.
6.
3
The estimated typical power dissipation for this family of PowerQUICC III devices is shown in
Freescale Semiconductor
Notes:
Notes:
1. The values do not include I/O supply power (OV
2. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
3. Typical power is based on a nominal voltage of V
4. Thermal solutions likely need to design to a value higher than Typical Power based on the end application, T
5. Maximum power is based on a nominal voltage of V
6. The nominal recommended V
CCB Frequency (MHz)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance. Any customer design must take these considerations into account to ensure the maximum 105 degrees junction
temperature is not exceeded on this device.
Dhrystone 2.1 benchmark application.
power
an artificial smoke test.
Power Characteristics
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
200
267
333
Core Frequency (MHz)
DD
= 1.3V for this speed grade.
1000
400
500
600
533
667
800
667
833
Table 4. Power Dissipation
(6)
DD
DD
, LV
DD
= 1.2V, a nominal process, a junction temperature of T
= 1.2V, worst case process, a junction temperature of T
DD
, GV
V
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.3
DD
DD
) or AV
DD.
Typical Power
(1) (2)
4.9
5.2
5.5
5.4
5.9
6.3
6.0
6.5
9.6
(3)(4)
(W)
Maximum Power
Power Characteristics
j
A
= 105° C, and a
target, and I/O
j
12.8
= 105° C, and
6.6
7.0
7.3
7.2
7.7
9.1
7.9
9.3
Table
(5)
(W)
4.
13