mpc8555e Freescale Semiconductor, Inc, mpc8555e Datasheet - Page 56

• Manufacturer Part Number: mpc8555e
• Description: Mpc8555e Powerquicc Iii Processor With Integrated Security
• Manufacturer: Freescale Semiconductor, Inc

Package and Pin Listings
Figure 40
Figure 41
14 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions.
14.1
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783
flip chip plastic ball grid array (FC-PBGA).
56
Die size
Package outline
Interconnects
Pitch
Minimum module height 3.07 mm
Maximum module height 3.75 mm
Solder Balls
Ball diameter (typical)
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
Package Parameters for the MPC8555E FC-PBGA
shows the PCI input AC timing conditions.
shows the PCI output AC timing conditions.
High-Impedance
Figure 41. PCI Output AC Timing Measurement Condition
Figure 40. PCI Input AC Timing Measurement Conditions
Output Delay
Input
CLK
Output
CLK
8.7 mm × 9.3 mm × 0.75 mm
29 mm × 29 mm
783
1 mm
62 Sn/36 Pb/2 Ag
0.5 mm
t
PCIVKH
t
PCKHOZ
t
PCKHOV
t
PCIXKH
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