mpc8560vt667jb Freescale Semiconductor, Inc, mpc8560vt667jb Datasheet - Page 100

• Manufacturer Part Number: mpc8560vt667jb
• Description: Mpc8560 Powerquicc Iii Integrated Communications Processor
• Manufacturer: Freescale Semiconductor, Inc

Document Revision History
100
Rev. No.
3.2
3.1
Updated
Added
Added CPM port signal drive strength to
Updated
Updated
Updated
Updated
Replaced
Added to
Added
Added precharge information to
Removed V
Added reference level note to
Updated TXD references to TCG in
Updated t
Updated PMA_RX_CLK references to RX_CLK in
Specifications”.
Updated RXD references to RCG in
Updated
Corrected
Updated
Added t
Corrected LGTA timing references in
Updated
Corrected FCC output timing reference labels in
Updated
Clarified
Updated
Added heat sink removal discussion to
Corrected and added 1 GHz part number to
Updated
Added
Added MCK duty cycle to
Updated f
Added LALE to t
Corrected active level designations of some of the pins in
Updated
Section 2.1.2, “Power
Section 4.4, “Real Time Clock
Table
LBKHKT
MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2
Table 54
Table 1
Table 4
Table 4
Table 6
Table 7
Table 27
Table 29
Figure
Figure
Table 55
Table 4
Table
Table 8
TTKHDX
MDC
Table 7
Table 29
IL
6.
and V
, t
Table 62. Document Revision History (continued)
63.
and updated Note 2 in
MDC
18,
50.
LBKHOV3
and
with Maximum power data.
and
with corrected typical I/O power numbers.
Note 2 lower voltage measurement point.
and
rise and fall time information.
value in
Note 5.
Note 5 with spread spectrum clocking guidelines.
Note 2.
t
and
MDKHDV
IH
f
, t
Figure
MDC
Table 2
Table 5
Table
MDKHDV
references from
Table 56
and t
parameter in
Table
Table
20, and
and t
5.
Sequencing”.
, and t
with 1.0 GHz device parameter requirements.
with 1 GHz speed grade information.
Table
MDC
with 1 GHz information.
25.
16.
Section 6.2.2, “DDR SDRAM Output AC Timing
MDKHDX
to reflect the correct minimum operating frequency.
Figure
MDKHDX
21,
Section 7.2.3.1, “TBI Transmit AC Timing
Section 7.2.3.2, “TBI Receive AC Timing
Figure
Timing”.
Table
Table
Table 31
Substantive Change(s)
Section 16.2.3, “Thermal Interface
Table
Table
values for clarification.
22.
parameters in
17.
32.
Table
21,
22,
3.
and
Table
Figure 24
Table
Section 7.2.3.2, “TBI Receive AC Timing
63.
Table
22,
23,
Table
Table
32, and updated
Table
and
Table
Figure
54.
23, and
29.
24,
Table
25.
Table
Materials”.
25,
Figure
Specifications”.
Specifications”.
24.
Table
Specifications”.
Freescale Semiconductor
17.
26, and
Table
27.