mc68hc908jb8 Freescale Semiconductor, Inc, mc68hc908jb8 Datasheet - Page 265

• Manufacturer Part Number: mc68hc908jb8
• Description: M68hc08 Microcontrollers
• Manufacturer: Freescale Semiconductor, Inc

19.4 28-Pin Small Outline Integrated Circuit (SOIC)
19.5 20-Pin Dual In-Line Package (PDIP)
MC68HC908JB8•MC68HC08JB8•MC68HC08JT8 — Rev. 2.3
Freescale Semiconductor
SEATING
PLANE
–T–
28
1
20
1
G
28X
26X
0.010 (0.25)
D
E
G
-A-
F
–A–
M
T
A
Figure 19-2. 28-Pin SOIC (Case 751F)
Figure 19-3. 20-Pin PDIP (Case 738)
S
D
20 PL
B
10
11
0.25 (0.010)
S
N
14
15
B
K
-B-
Mechanical Specifications
C
K
M
SEATING
PLANE
-T-
C
T
R
14X
A
X 45
P
0.010 (0.25)
M
J
L
M
20 PL
0.25 (0.010)
B
M
28-Pin Small Outline Integrated Circuit (SOIC)
M
J
M
M
T
F
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
NOTES:
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD
DIM
G
M
A
B
C
D
F
J
K
P
R
Y14.5M, 1982.
FORMED PARALLEL.
FLASH.
DIM
A
B
C
D
E
G
K
M
N
F
J
L
17.80
10.01
MILLIMETERS
Mechanical Specifications
MIN
7.40
2.35
0.35
0.41
0.23
0.13
0.25
0°
1.010
0.240
0.150
0.015
0.050
0.008
0.020
0.110
1.27 BSC
MIN
0.050 BSC
0.100 BSC
0.300 BSC
0
INCHES
18.05
10.55
MAX
7.60
2.65
0.49
0.90
0.32
0.29
0.75
8°
0.140
1.070
0.260
0.180
0.022
0.070
0.015
0.040
MAX
15
0.701
0.292
0.093
0.014
0.016
0.009
0.005
0.395
0.010
MIN
0.050 BSC
0°
25.66
MILLIMETERS
MIN
INCHES
6.10
3.81
0.39
1.27
0.21
2.80
0.51
Technical Data
1.27 BSC
2.54 BSC
7.62 BSC
0
MAX
0.711
0.299
0.104
0.019
0.035
0.013
0.011
0.415
0.029
8°
27.17
MAX
6.60
4.57
0.55
1.77
0.38
3.55
1.01
15
265