MT29F128G08WAAC6 Micron, MT29F128G08WAAC6 Datasheet - Page 113

• Manufacturer Part Number: MT29F128G08WAAC6
• Description: NAND Flash Memory
• Manufacturer: Micron

52-Pad LLGA
Figure 96:
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although
PDF: 09005aef8278ee3f / Source: 09005aef81f17540
16gb_nand_mlc_l52a__2.fm -Rev. D 5/08 EN
considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
13 12 10
12X Ø1
40X Ø0.7
5
6
52-Pad LLGA Package
TYP
2
1
OA
OD
OB
OC
OE
OF
1
Notes: 1. All dimensions are in millimeters.
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
8
7 ±0.08
2. Pads are nonsolder-mask defined (NSMD) and are plated with 3–15 microns of nickel fol-
3. Primary datum A (seating plane) is defined by the bottom terminal surface.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
7
All other trademarks are the property of their respective owners.
lowed by a minimum of 0.1 microns of soft wire bondable gold (99.99% pure).
Metallized test terminal lands or interconnect terminals need not extend below the
package bottom surface.
6
14 ±0.15
5
2
10
6
4
4
3
3
See Detail A
Micron Confidential and Proprietary
2 TYP
2
5
1
0
Terminal A1 ID
113
A
B
C
D
E
F
G
H
J
K
L
M
N
TYP
7.8
2
Seating
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9 ±0.08
plane
6.5
®
0.08 A
18 ±0.15
16, 32, 64, 128Gb NAND Flash Memory
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.47 MAX
Not to scale
A
Detail A
Substrate material: plastic laminate
Mold compound: epoxy novolac
2
See Note 1
Terminal A1 ID
Package Information
©2005 Micron Technology, Inc. All rights reserved.
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