MT55L256L32P Micron Semiconductor Products, Inc., MT55L256L32P Datasheet - Page 15

• Manufacturer Part Number: MT55L256L32P
• Description: 8Mb: 512K X 18, 256K X 32/36 Pipelined ZBT SRAM
• Manufacturer: Micron Semiconductor Products, Inc.

ABSOLUTE MAXIMUM RATINGS*
Voltage on V
Voltage on V
V
Storage Temperature (plastic) .......... -55°C to +150°C
Storage Temperature (FBGA) .......... -55°C to +125°C
Junction Temperature** .................................. +150°C
Short Circuit Output Current .......................... 100mA
3.3V I/O DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS
(0°C
NOTE: 1. All voltages referenced to V
8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
MT55L512L18P_C.p65 – Rev. 2/02
IN
DESCRIPTION
Input High (Logic 1) Voltage
Input High (Logic 1) Voltage
Input Low (Logic 0) Voltage
Input Leakage Current
Output Leakage Current
Output High Voltage
Output Low Voltage
Supply Voltage
Isolated Output Buffer Supply
Relative to V
Relative to V
-0.5V to V
T
2. Overshoot:
3. MODE pin has an internal pull-up, and input leakage = ±10µA.
4. The load used for V
5. V
A
Undershoot:
Power-up:
curves are available upon request.
DD
+70°C; V
Q should never exceed V
DD
DD
SS
SS
DD
Q Supply
Supply
................................... -0.5V to +4.6V
....................................... -0.5V to V
Q + 0.5V
DD
V
V
V
, V
IH
IL
IH
DD
-0.7V for t
OH
+4.6V for t
+3.465V and V
Q = +3.3V ±0.165V unless otherwise noted)
, V
OL
testing is shown in Figure 2. AC load current is higher than the shown DC values. AC I/O
SS
DD
(GND).
. V
t
Output(s) disabled,
t
KHKH/2 for I
DD
KHKH/2 for I
DD
0V
0V
CONDITIONS
and V
I
OH
I
OL
DQ pins
+3.135V for t
= -4.0mA
= 8.0mA
V
V
DD
IN
IN
Q can be externally wired together to the same power supply.
V
V
DD
20mA
DD
DD
20mA
15
200ms
*Stresses greater than those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only, and functional
operation of the device at these or any other conditions
above those indicated in the operational sections of
this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may
affect reliability.
**Junction temperature depends upon package
type, cycle time, loading, ambient temperature, and
airflow. See Micron Technical Note TN-05-14 for more
information.
SYMBOL
8Mb: 512K x 18, 256K x 32/36
V
V
V
V
V
V
IL
V
DD
IL
OH
DD
OL
IH
IH
IL
O
I
Q
Micron Technology, Inc., reserves the right to change products or specifications without notice.
3.135
3.135
MIN
-1.0
-0.3
-1.0
2.0
2.0
2.4
–
PIPELINED ZBT SRAM
V
V
DD
DD
3.465
MAX
V
0.8
1.0
1.0
0.4
–
+ 0.3
+ 0.3
DD
UNITS
µA
µA
V
V
V
V
V
V
V
©2002, Micron Technology, Inc.
NOTES
1, 2
1, 2
1, 2
1, 4
1, 4
1, 5
3
1