MT55L256L32F Micron Semiconductor Products, Inc., MT55L256L32F Datasheet - Page 11

• Manufacturer Part Number: MT55L256L32F
• Description: 8Mb ZBT SRAM, 3.3V Vdd, 3.3V or 2.5V I/O, Flow-Through,
• Manufacturer: Micron Semiconductor Products, Inc.

FBGA PIN DESCRIPTIONS (continued)
8Mb: 512K x 18, 256K x 32/36 Flow-Through ZBT SRAM
MT55L512L18F_C.p65 – Rev. 2/02
7M, 7N, 8C, 8N 7M, 7N, 8C, 8N
5P, 5R, 7P, 7R 5P, 5R, 7P, 7R
5C, 5D, 5E, 5F, 5C, 5D, 5E, 5F,
6C, 6D, 6E, 6F, 6C, 6D, 6E, 6F,
6N, 9H, 10C,
2M, 2N, 2P,
2R, 3H, 4B,
9B, 5A, 5N,
1A, 1B, 1C,
1G, 1P, 2C,
5K, 5L, 5M,
6K, 6L, 6M,
1D, 1E, 1F,
11M, 11N,
1H, 4C, 4N,
5G, 5H, 5J,
6G, 6H, 6J,
7C, 7D, 7E,
7F, 7G, 7H,
2J, 2K, 2L,
10H, 10N,
7J, 7K, 7L,
10D, 10E,
10F, 10G,
11K, 11L,
11B, 11J,
x18
11P
2R, 3H, 5N,
6N, 9B, 9H,
5K, 5L, 5M,
6K, 6L, 6M,
1A, 1B, 1P,
7F, 7G, 7H,
1H, 4C, 4N,
5G, 5H, 5J,
6G, 6H, 6J,
7C, 7D, 7E,
2C, 2N, 2P,
7J, 7K, 7L,
10C, 10H,
10N, 11A,
11B, 11P
x32/x36
SYMBOL
DNU
NC
V
NF
SS
Supply Ground: GND.
TYPE
—
–
–
Do Not Use: These signals may either be unconnected or wired to
GND to improve package heat dissipation.
No Connect: These signals are not internally connected and may
be connected to ground to improve package heat dissipation.
Pin 9B is reserved for 16MB address expansion.
No Function: These pins are internally connected to the die and
have the capacitance of an input pin. It is allowable to leave
these pins unconnected or driven by signals.
11
8Mb: 512K x 18, 256K x 32/36
FLOW-THROUGH ZBT SRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DESCRIPTION
©2002, Micron Technology, Inc.