MT55L256L32F Micron Semiconductor Products, Inc., MT55L256L32F Datasheet
MT55L256L32F
Related parts for MT55L256L32F
MT55L256L32F Summary of contents
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... Commercial (0ºC to +70ºC) Industrial (-40°C to +85°C)** Part Number Example: MT55L256L32FT-11 8Mb: 512K x 18, 256K x 32/36 Flow-Through ZBT SRAM MT55L512L18F_C.p65 – Rev. 2/02 8Mb: 512K x 18, 256K x 32/36 FLOW-THROUGH ZBT SRAM MT55L512L18F, MT55L512V18F, MT55L256L32F, MT55L256V32F, MT55L256L36F, MT55L256V36F 3. 3.3V or 2.5V I NOTE: 1. JEDEC-standard MS-026 BHA (LQFP). MARKING - Part Marking Guide for the FBGA devices can be found on Micron’ ...
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SA0, SA1, SA MODE CE CLK K CKE# ADV/LD# BWa# BWb# R/W# OE# CE# CE2 CE2# 18 SA0, SA1, SA MODE CE CLK K CKE# ADV/LD# BWa# BWb# BWc# BWd# R/W# OE# CE# CE2 CE2# NOTE: Functional block diagrams ...
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GENERAL DESCRIPTION (continued) (ADV/LD#), synchronous clock enable (CKE#), byte write enables (BWa#, BWb#, BWc#, and BWd#), and read/write (R/W#). Asynchronous inputs include the output enable (OE#, which may be tied LOW for control signal mini- mization), clock (CLK), and snooze ...
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TQFP PIN ASSIGNMENT TABLE PIN # x18 x32 x36 PIN # DQPc DQc DQc DQc DQc DQc DQc 31 ...
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ADV/LD# 85 OE# (G#) 86 CKE# 87 R/W# 88 CLK CE2# 92 BWa# 93 BWb CE2 97 CE# 98 ...
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TQFP PIN DESCRIPTIONS x18 x32/x36 32-35, 44-50, 32-35, 44-50, 80-83, 99, 81-83, 99, 100 100 – 95 – ...
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TQFP PIN DESCRIPTIONS (CONTINUED) x18 x32/x36 (a) 58, 59, 62, 63, (a) 52, 53, 56-59, 68, 69, 72-74 62 12, 13, (b) 68, 69, 72-75, 18, 19, 22-24 78, 79 (c) 2, ...
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CE# BWb# NC CE2# CKE CE2 NC BWa# CLK R/ ...
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FBGA PIN DESCRIPTIONS x18 x32/x36 SYMBOL 2A, 9A, 2B, 2A, 9A, 2B, 3P, 3R, 4P, 4R, 3P, 3R, 4P, 4R, 8P, 8R, 9P, 9R, 8P, 8R, 9P, 10A, 10B, 10P, 9R, 10A, 10B, 10R, 11A, 11R ...
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FBGA PIN DESCRIPTIONS (continued) x18 x32/x36 SYMBOL 8A 8A ADV/LD# Input Synchronous Address Advance/Load: When HIGH, this input MODE (LB0#) (a) 10J, 10K, (a) 10J, 10K, 10L, 10M, 11D, 10L, 10M, 11J, 11E, 11F, 11G 11K, 11L, ...
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FBGA PIN DESCRIPTIONS (continued) x18 x32/x36 SYMBOL 1H, 4C, 4N, 1H, 4C, 4N, 5C, 5D, 5E, 5F, 5C, 5D, 5E, 5F, 5G, 5H, 5J, 5G, 5H, 5J, 5K, 5L, 5M, 5K, 5L, 5M, 6C, 6D, 6E, 6F, 6C, 6D, 6E, ...
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INTERLEAVED BURST ADDRESS TABLE (MODE = NC OR HIGH) FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) X...X00 X...X01 X...X10 X...X11 LINEAR BURST ADDRESS TABLE (MODE = LOW) FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) X...X00 X...X01 X...X10 X...X11 PARTIAL TRUTH TABLE FOR ...
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DS BEGIN READ READ READ BURST BURST READ KEY: COMMAND DS READ WRITE BURST NOTE STALL or IGNORE CLOCK EDGE cycle is not shown in the above diagram. This is because CKE# HIGH only blocks the clock (CLK) ...
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TRUTH TABLE (Notes 5-10) OPERATION DESELECT Cycle DESELECT Cycle DESELECT Cycle CONTINUE DESELECT Cycle READ Cycle (Begin Burst) READ Cycle (Continue Burst) NOP/DUMMY READ (Begin Burst) DUMMY READ (Continue Burst) WRITE Cycle (Begin Burst) WRITE Cycle (Continue Burst) NOP/WRITE ABORT ...
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ABSOLUTE MAXIMUM RATINGS* Voltage on V Supply DD Relative to V .................................. -0.5V to +4.6V SS Voltage Supply DD Relative to V ..................................... -0. ............................................... -0. Storage Temperature (TQFP) ............ ...
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I/O DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS (0° +70° +3.3V ±0.165V DESCRIPTION Input High (Logic 1) Voltage Input Low (Logic 0) Voltage Input Leakage Current Output Leakage Current Output High Voltage ...
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I OPERATING CONDITIONS AND MAXIMUM LIMITS DD (Note 1) (0° +70° +3.3V ±0.165V unless otherwise noted DESCRIPTION Power Supply Device selected; All inputs V Current: Operating Cycle time IH V ...
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FBGA THERMAL RESISTANCE DESCRIPTION Junction to Ambient Test conditions follow standard test methods (Airflow of 1m/s) Junction to Case (Top) Junction to Pins (Bottom) AC ELECTRICAL CHARACTERISTICS (Notes (0° +70° DESCRIPTION Clock ...
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I/O AC TEST CONDITIONS Input pulse levels ................................... V Input rise and fall times ..................................... 1ns Input timing reference levels .......................... 1.5V Output reference levels ................................... 1.5V Output load ............................. See Figures 1 and 2 3.3V I/O Output Load ...
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SNOOZE MODE SNOOZE MODE is a low-current, “power-down” mode in which the device is deselected and current is reduced The duration of SNOOZE MODE dictated by the length of time the ZZ pin ...
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CLK t EVKH t KHEX t KHKL CKE# t CVKH t KHCX CE# ADV/LD# R/W# BWx ADDRESS t AVKH t KHAX DQ D(A1) t DVKH t KHDX OE# COMMAND WRITE WRITE D(A1) D(A2) READ/WRITE TIMING PARAMETERS ...
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CLK CKE# CE# ADV/LD# R/W# BWx ADDRESS D(A1) DQ COMMAND WRITE READ D(A1) Q(A2) NOP, STALL, AND DESELECT TIMING PARAMETERS -10 -11 SYM MIN MAX MIN MAX t KHQX 3.0 3.0 t KHQZ 5.0 5.0 NOTE: ...
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PIN #1 ID 14.00 ±0.10 +0.20 16.00 -0.05 NOTE: 1. All dimensions in millimeters. 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side. 8Mb: 512K x 18, 256K x 32/36 Flow-Through ZBT ...
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BALL A11 165X Ø 0.45 SOLDER BALL DIAMETER REFERS TO POST REFLOW CONDITION. THE PRE-REFLOW DIAMETER IS Ø 0.40 7.50 ±0.05 15.00 ±0.10 7.00 ±0.05 5.00 ±0.05 NOTE: 1. All dimensions in millimeters MAX or typical where noted. ...
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REVISION HISTORY Removed "Preliminary Package Data" from front page ....................................................................... February 22/02 Removed 119-pin PBGA package and references ................................................................................. February 14/02 Removed note "Not Recommended for New Designs," Rev. 6/01 ................................................................ June 7/01 Added industrial temperature references and notes, Rev. ...