HY27UF081G2M Hynix Semiconductor, HY27UF081G2M Datasheet - Page 8

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HY27UF081G2M

Manufacturer Part Number
HY27UF081G2M
Description
(HY27UF(08/16)1G2M / HY27SF(08/16)1G2M) 1Gbit (128Mx8bit/64Mx16bit) NAND Flash Memory
Manufacturer
Hynix Semiconductor
Datasheet

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1.2 PIN DESCRIPTION
Rev 0.6 / Mar. 2005
IO8-IO15(1)
NOTE:
1. For x16 version only
2. A 0.1uF capacitor should be connected between the VCC Supply Voltage pin and the VSS Ground pin to decouple
Pin Name
IO0-IO7
the current surges from the power supply. The PCB track widths must be sufficient to carry the currents required
during program and erase operations.
VCCQ
WE#
WP#
RB#
CE#
RE#
VCC
VSS
PRE
CLE
ALE
NC
DATA INPUTS/OUTPUTS
The IO pins allow to input command, address and data and to output data during read / program
operations. The inputs are latched on the rising edge of Write Enable (WE#). The I/O buffer float to
High-Z when the device is deselected or the outputs are disabled.
COMMAND LATCH ENABLE
This input activates the latching of the IO inputs inside the Command Register on the Rising edge of
Write Enable (WE#).
ADDRESS LATCH ENABLE
This input activates the latching of the IO inputs inside the Command Register on the Rising edge of
Write Enable (WE#).
CHIP ENABLE
This input controls the selection of the device. When the device is busy CE# low does not deselect
the memory.
WRITE ENABLE
This input acts as clock to latch Command, Address and Data. The IO inputs are latched on the rise
edge of WE#.
READ ENABLE
The RE# input is the serial data-out control, and when active drives the data onto the I/O bus. Data
is valid tREA after the falling edge of RE# which also increments the internal column address counter
by one.
WRITE PROTECT
The WP# pin, when Low, provides an Hardware protection against undesired modify (program /
erase) operations.
READY BUSY
The Ready/Busy output is an Open Drain pin that signals the state of the memory.
SUPPLY VOLTAGE
The VCC supplies the power for all the operations (Read, Write, Erase). An internal lock circuit
prevent the insertion of Commands when VCC is less than VLKO
SUPPLY VOLTAGE FOR I/O BUFFERS
This pin is today internally connected to VCC and must be shorted with VCC pin at system level
GROUND
NOT CONNECTED
To Enable Power On Auto Read. When PRE is a logic high, Power on Auto Read mode is enabled, and
when PRE is a logic low, Power Auto Read mode is disabled. Power On Auto Read mode is available
only on 3.3V device(HYUF(08/16)1G2M.
Not using POWER-ON AUTO-READ, connect it Vss or leave it N.C.
Table 2: Pin Description
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash
Description
HY27UF(08/16)1G2M Series
HY27SF(08/16)1G2M Series
Preliminary
8

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