21154BC Intel, 21154BC Datasheet - Page 24

• Manufacturer Part Number: 21154BC
• Manufacturer: Intel

Specifications of 21154BC

• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Operating Temperature (max): 70C
• Package Type: BGA
• Rad Hardened: No
• Lead Free Status / Rohs Status: Not Compliant

Documentation Changes
Documentation Changes
1.
Table 40.
2.
3.
4.
24Intel Confidential
Section 17.2, Table 40, Absolute Maximum Ratings
Maximum power P
Section 18.0, Paragraph 1
Section 18.0. Paragraph 1 is changed to read as follows:
The 21154 variants are contained in the 304-point plastic ball grid array (PBGA) packages shown
in Figure 25. The 21154AC/BC and 21154AE/BE variants utilize a 4-layer 304-point PBGA. All
other variants utilize a 2-layer 304-point PBGA.
Section 18.0, Figure 25, 304-Point 2-Layer PBGA Package
Section 18.0, Figure 25 title is changed to read as follows:
304-Point PBGA Package (2-Layer and 4-Layer)
Section 18.0, Table 51, 304-Point 2-Layer PBGA Package Dimensions
Section 18.0, Table 51 title is changed to read as follows:
304-Point PBGA Package Dimensions (2-Layer and 4-Layer)
Absolute Maximum Ratings
Junction temperature, T
Maximum voltage applied
to signal pins
Supply voltage, V
Maximum Power, P
Storage temperature range, T
cc
wc
Parameter
wc
j
is changed from 2.2W to 2.9W.
sg
21154 PCI-to-PCI Bridge Specification Update
Minimum
-55
—
—
—
—
o
C
Maximum
125
125
2.9 W
5.5 V
3.9 V
o
o
C
C