MT46H32M16LFBF-6 AT:C Micron Technology Inc, MT46H32M16LFBF-6 AT:C Datasheet - Page 90

• Manufacturer Part Number: MT46H32M16LFBF-6 AT:C
• Manufacturer: Micron Technology Inc

Specifications of MT46H32M16LFBF-6 AT:C

• Lead Free Status / Rohs Status: Supplier Unconfirmed

SELF REFRESH Operation
PDF: 09005aef83dd2b3e
t67m_512mb_mobile_lpddr.pdf - Rev. E 6/11 EN
The SELF REFRESH command can be used to retain data in the device while the rest of
the system is powered down. When in self refresh mode, the device retains data without
external clocking. The SELF REFRESH command is initiated like an AUTO REFRESH
command, except that CKE is disabled (LOW). All command and address input signals
except CKE are “Don’t Care” during self refresh.
During self refresh, the device is refreshed as defined in the extended mode register.
(see Partial-Array Self Refresh (page 56).) An internal temperature sensor adjusts the
refresh rate to optimize device power consumption while ensuring data integrity. (See
Temperature-Compensated Self Refresh (page 55).)
The procedure for exiting self refresh requires a sequence of commands. First, CK must
be stable prior to CKE going HIGH. When CKE is HIGH, the device must have NOP com-
mands issued for
During SELF REFRESH operation, refresh intervals are scheduled internally and may
vary. These refresh intervals may differ from the specified
the SELF REFRESH command must not be used as a substitute for the AUTO REFRESH
command.
t
XSR to complete any internal refresh already in progress.
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512Mb: x16, x32 Mobile LPDDR SDRAM
Micron Technology, Inc. reserves the right to change products or specifications without notice.
SELF REFRESH Operation
t
REFI time. For this reason,
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