ADDS-BF533-EZLITE Analog Devices Inc, ADDS-BF533-EZLITE Datasheet - Page 58

• Manufacturer Part Number: ADDS-BF533-EZLITE
• Manufacturer: Analog Devices Inc

Specifications of ADDS-BF533-EZLITE

• Significant Other Parts: ADV7183 Video Decode
• Lead Free Status / Rohs Status: Not Compliant

ADSP-BF531/ADSP-BF532/ADSP-BF533
SURFACE MOUNT DESIGN
Table 40
standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface Mount Design and Land Pat­
tern Standard.
Table 40. BGA Data for Use with Surface Mount Design
Package
Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-2
Plastic Ball Grid Array (PBGA) B-169
is provided as an aid to PCB design. For industry-
NOTES
1. DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIES WITH JEDEC REGISTERED OUTLINE
MS-034, VARIATION AAG-2
3. MINIMUM BALL HEIGHT 0.40
A1 BALL PAD CORNER
SIDE VIEW
TOP VIEW
19.00 BSC SQ
.
Figure 63. 169-Ball Plastic Ball Grid Array (B-169)
DETAIL A
Rev. E | Page 58 of 60 | July 2007
Ball Attach Type
Solder Mask Defined
Solder Mask Defined
BALL DIAMETER
0.20 MAX
COPLANARITY
1.00 BSC
BALL PITCH
M
G
A
B
C
D
E
H
K
N
P
R
U
F
J
L
T
0.70
0.60
0.50
Solder Mask Opening
0.40 mm diameter
0.43 mm diameter
17
16
15
14
13
DETAIL A
12
BOTTOM VIEW
16.00 BSC SQ
11
10
9
8
7
6
5
4
3
SEATING PLANE
2
Ball Pad Size
0.55 mm diameter
0.56 mm diameter
1
0.40 MIN