ADDS-BF533-EZLITE Analog Devices Inc, ADDS-BF533-EZLITE Datasheet - Page 48

• Manufacturer Part Number: ADDS-BF533-EZLITE
• Manufacturer: Analog Devices Inc

Specifications of ADDS-BF533-EZLITE

• Significant Other Parts: ADV7183 Video Decode
• Lead Free Status / Rohs Status: Not Compliant

ADSP-BF531/ADSP-BF532/ADSP-BF533
Figure 55. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
Figure 56. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
where:
T
T
center of package.
Ψ
P
the method to calculate P
Values of θ
circuit board design considerations. θ
order approximation of T
D
J
CASE
JT
= junction temperature (�C).
= power dissipation (see
14
12
10
18
16
14
12
10
= from
8
6
4
2
0
8
6
4
2
0
0
0
= case temperature (�C) measured by customer at top
JA
Table 31
are provided for package comparison and printed
50
50
T
for Driver D at V
for Driver D at V
through
J
T
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
= T
J
= T
D
J
100
).
100
by the equation:
CASE
Power Dissipation on Page 45
A
RISE TIME
Table
RISE TIME
+ (θ
+ (Ψ
DDEXT
DDEXT
JA
33.
JT
× P
= 2.25 V
= 3.65 V
150
150
JA
× P
FALL TIME
FALL TIME
can be used for a first
D
)
D
)
200
200
Rev. E | Page 48 of 60 | July 2007
for
250
250
where:
T
In
with JEDEC standards JESD51–2 and JESD51–6, and the junc­
tion-to-board measurement complies with JESD51–8. The
junction-to-case measurement complies with MIL-STD-883
(Method 1012.1). All measurements use a 2S2P JEDEC test
board.
Thermal resistance θ
of merit relating to performance of the package and board in a
convective environment. θ
under two conditions of airflow. Ψ
between T
Table 31. Thermal Characteristics for BC-160 Package
Table 32. Thermal Characteristics for ST-176-1 Package
Table 33. Thermal Characteristics for B-169 Package
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
A
JA
JMA
JMA
JC
JA
JMA
JMA
JA
JMA
JMA
JC
JT
JT
JT
JT
JT
JT
JT
JT
JT
Table 31
= ambient temperature (�C).
J
and T
through
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
CASE
Table
JA
.
in
Table 31
JMA
33, airflow measurements comply
represents the thermal resistance
through
JT
represents the correlation
Table 33
Typical
27.1
23.85
22.7
7.26
0.14
0.26
0.35
Typical
34.9
33.0
32.0
0.50
0.75
1.00
Typical
22.8
20.3
19.3
10.39
0.59
0.88
1.37
is the figure
Unit
�C/W
�C/W
�C/W
�C/W
�C/W
�C/W
�C/W
Unit
�C/W
�C/W
�C/W
�C/W
�C/W
�C/W
Unit
�C/W
�C/W
�C/W
�C/W
�C/W
�C/W
�C/W