TSPC603RVA8LC Atmel, TSPC603RVA8LC Datasheet - Page 47

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TSPC603RVA8LC

Manufacturer Part Number
TSPC603RVA8LC
Description
IC MPU 32BIT 8MHZ 240CERQUAD
Manufacturer
Atmel
Datasheet

Specifications of TSPC603RVA8LC

Processor Type
PowerPC 603e 32-Bit RISC
Speed
200MHz
Voltage
2.5V
Mounting Type
Surface Mount
Package / Case
240-Cerquad
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
15. Package Mechanical Data
15.1
5410B–HIREL–09/05
HiTCE CBGA Package Parameters
The following sections provide the package parameters and mechanical dimensions for the
CBGA, HiTCE CBGA and the Cerquad packages.
The package parameters are as provided in the following list. The package type is 21 mm, 255-
lead HiTCE Ceramic Ball Array (HiTCE CBGA).
Package outline
Interconnects
Pitch
Maximum module height
255
1.27 mm
21 mm × 21 mm
3.08 mm
TSPC603R
47

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