MC68MH360AI33L Freescale Semiconductor, MC68MH360AI33L Datasheet - Page 116

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MC68MH360AI33L

Manufacturer Part Number
MC68MH360AI33L
Description
IC MPU QUICC 33MHZ 240-FQFP
Manufacturer
Freescale Semiconductor
Datasheets

Specifications of MC68MH360AI33L

Processor Type
M683xx 32-Bit
Speed
33MHz
Voltage
5V
Mounting Type
Surface Mount
Package / Case
240-FQFP
Family Name
M68xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
33MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
5V
Operating Supply Voltage (max)
5.25V
Operating Supply Voltage (min)
4.75V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
240
Package Type
FQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68MH360AI33L
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
In the worst-case scenario, all channels open and close a buffer during the same TDM frame
resulting in the peak load all performance calculations are based on. This peak load is far
from the norm and can be controlled by the transmitter spreading the starting point of
transmit buffers over several TDM frames.
In multimaster systems, bus latency may affect the performance of the device. The
maximum external bus latency figures shown in Table 8-4 are measured from the assertion
of the BR (bus request) to the assertion of the BGACK (bus grant acknowledge); that is,
from start of bus request output being active until the cycle is completed. For multimaster
systems, bus arbitration overhead is included. Latencies of up to 40 clocks were simulated;
for values over 40, the acceptable latency may be larger.
Table 8-4 shows average maximum acceptable bus latencies, meaning the device can
tolerate longer bus delays if they are infrequent. For lengthy delays, a larger FIFO can pick
up the slack, continuing emptying or filling depending on the data flow direction.
Therefore, the larger the FIFO the more tolerant the system is to infrequent peaks in bus
delays. However, the average acceptable bus latency still depends on the overall data rate
and frame length and not on the FIFO size.
Not supported
Not supported
9 clocks
8 clocks
40 clocks
33 clocks
8 clocks
Not supported
40 clocks
Maximum Acceptable Latency
25 MHz
(Bus Cycles)
Freescale Semiconductor, Inc.
For More Information On This Product,
12
11
>40
35
>40
>40
24
23
>40
33 MHZ
Table 8-4. Simulated Latencies
Go to: www.freescale.com
SCC1: Ethernet; SCC2: 16 x 64 Kbps; SCC3: 16 x 64 Kbps
SCC1: Ethernet; SCC2: 16 x 64 Kbps; SCC3: 16 x 64 Kbps;
SCC4: 64 Kbps HDLC
SCC1: 32 x 64 Kbps. Serial bit rate 2.048 Mbps (E1/CEPT)
SCC1: 32 x 64 Kbps; SCC2: 64 Kbps; SCC3: 64 Kbps; SCC4: 64 Kbps;
all HDLC
QMC with 24 channels. Serial bit rate 1.544 Mbps (T1)
SCC1: 24 x 64 Kbps; SCC2: 64 Kbps; SCC3: 64 Kbps; SCC4: 64 Kbps;
all HDLC
SCC1: Ethernet; SCC2: 12 x 64 Kbps; SCC3: 12 x 64 Kbps.
TDM bit rate = 1.544 Mbps
SCC1: Ethernet; SCC2: 12 x 64 Kbps; SCC3: 12 x 64 Kbps;
SCC4: 64-Kbps HDLC.
TDM bit rate = 1.544 Mbps
SCC1: 16 x 128 Kbps. TDM bit rate = 2.048 Mbps
QMC Supplement
Channel Combinations

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