EP1S20F780C7 Altera, EP1S20F780C7 Datasheet - Page 12
![IC STRATIX FPGA 20K LE 780-FBGA](/photos/6/72/67270/544-780-fbga_sml.jpg)
EP1S20F780C7
Manufacturer Part Number
EP1S20F780C7
Description
IC STRATIX FPGA 20K LE 780-FBGA
Manufacturer
Altera
Series
Stratix®r
Datasheet
1.EP1S10F780C7.pdf
(276 pages)
Specifications of EP1S20F780C7
Number Of Logic Elements/cells
18460
Number Of Labs/clbs
1846
Total Ram Bits
1669248
Number Of I /o
586
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
780-FBGA
Family Name
Stratix
Number Of Logic Blocks/elements
18460
# I/os (max)
586
Frequency (max)
420.17MHz
Process Technology
0.13um (CMOS)
Operating Supply Voltage (typ)
1.5V
Logic Cells
18460
Ram Bits
1669248
Operating Supply Voltage (min)
1.425V
Operating Supply Voltage (max)
1.575V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
780
Package Type
FC-FBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Not Compliant
Other names
544-1116
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP1S20F780C7
Manufacturer:
ALTERA
Quantity:
1 238
Company:
Part Number:
EP1S20F780C7
Manufacturer:
ALTERA
Quantity:
453
Company:
Part Number:
EP1S20F780C7L
Manufacturer:
NXP
Quantity:
1 448
Company:
Part Number:
EP1S20F780C7N
Manufacturer:
ALTERA
Quantity:
3 000
Features
1–4
Stratix Device Handbook, Volume 1
Note to
(1)
EP1S10
EP1S20
EP1S25
EP1S30
EP1S40
EP1S60
EP1S80
Pitch (mm)
Area (mm
Length × width (mm × mm)
Table 1–3. Stratix Package Options & I/O Pin Counts
Table 1–4. Stratix BGA Package Sizes
Device
All I/O pin counts include 20 dedicated clock input pins (clk[15..0]p, clk0n, clk2n, clk9n, and clk11n)
that can be used for data inputs.
Table
2
)
Dimension
1–3:
672-Pin
BGA
345
426
473
956-Pin
Stratix devices are available in space-saving FineLine BGA
array (BGA) packages (see
support vertical migration within the same package (for example, you
can migrate between the EP1S10, EP1S20, and EP1S25 devices in the 672-
pin BGA package). Vertical migration means that you can migrate to
devices whose dedicated pins, configuration pins, and power pins are the
same for a given package across device densities. For I/O pin migration
across densities, you must cross-reference the available I/O pins using
the device pin-outs for all planned densities of a given package type to
identify which I/O pins are migrational. The Quartus
automatically cross reference and place all pins except differential pins
for migration when given a device migration list. You must use the pin-
outs for each device to verify the differential placement migration. A
future version of the Quartus II software will support differential pin
migration.
BGA
683
683
683
683
FineLine
484-Pin
BGA
335
361
672 Pin
35 × 35
1,225
1.27
FineLine
672-Pin
BGA
345
426
473
Tables 1–3
FineLine
780-Pin
BGA
426
586
597
597
615
through 1–5). All Stratix devices
1,020-Pin
FineLine
BGA
706
726
773
773
773
956 Pin
40 × 40
®
1,600
1.27
Altera Corporation
II software can
®
and ball-grid
1,508-Pin
FineLine
1,022
1,203
BGA
July 2005
822