XC4005L-5PQ100C Xilinx Inc, XC4005L-5PQ100C Datasheet - Page 105

IC 3.3V FPGA 196 CLB'S 100-PQFP

XC4005L-5PQ100C

Manufacturer Part Number
XC4005L-5PQ100C
Description
IC 3.3V FPGA 196 CLB'S 100-PQFP
Manufacturer
Xilinx Inc
Series
XC4000r
Datasheet

Specifications of XC4005L-5PQ100C

Number Of Logic Elements/cells
466
Number Of Labs/clbs
196
Total Ram Bits
6272
Number Of I /o
77
Number Of Gates
5000
Voltage - Supply
3 V ~ 3.6 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
100-BQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
122-1121

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XC4005L-5PQ100C
Manufacturer:
Xilinx Inc
Quantity:
10 000
Part Number:
XC4005L-5PQ100C
Manufacturer:
XILINX
0
4/2/96
Pads labelled GND* are internally bonded to a Ground
plane within the BG225 package. They have no direct con-
nection to any specific package pin.
Pads labelled VCC* are internally bonded to a Vcc plane
within the BG225 package. They have no direct connection
to any specific package pin.
September 18, 1996 (Version 1.04)
O, TDO
GND
I/O
(A0, WS)
I/O, PGCK4
(A1)
I/O
I/O
I/O
(CS1, A2)
I/O (A3)
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
VCC
I/O (A4)
I/O (A5)
I/O
I/O
I/O
I/O
I/O (A6)
I/O (A7)
GND
XC4013E/L
Pad Name
P121
P122
P123
P124
P125
P126
P127
P128
P129
P130
P131
P132
P133
P134
P135
P136
P137
P138
P139
P140
P141
160
PQ
-
-
-
-
-
-
-
-
P159
P160
P161
P162
P163
P164
P165
P166
P167
P168
P169
P170
P171
P172
P173
P174
P175
P176
P177
P178
P179
P180
P181
P182
PQ/
208
HQ
-
-
-
-
-
223
PG
U2
R3
U1
R2
N3
N4
R1
N2
M3
N1
M4
M2
M1
T3
P3
T2
P4
P2
T1
P1
L4
L3
L2
L1
K1
K2
K3
K4
-
GND*
VCC*
225
A15
D12
A14
B13
E11
C12
A13
B12
D11
A12
C11
B11
E10
A11
D10
C10
B10
A10
BG
F9
D9
C9
B9
A9
E9
C8
B8
A8
P181
P182
P183
P184
P185
P186
P187
P188
P189
P190
P191
P192
P193
P194
P196
P197
P198
P199
P200
P201
P202
P203
P205
P206
P207
P208
P209
P210
P211
PQ/
240
HQ
Bndry
Scan
11
14
17
20
23
26
29
32
35
38
41
44
47
50
53
56
59
62
65
68
71
0
2
5
8
-
-
-
-
Additional Ground (GND) Connections on BG225
Packages
3/11/96
The BG225 package pins in this table are bonded to an in-
ternal Ground plane on the XC4013E/L die. They must all
be externally connected to Ground.
Additional No Connect (N.C.) Connections on PQ/
HQ208 & PQ/HQ240 Packages
3/20/96
‡ Pins marked with this symbol are reserved for Ground
connections on future revisions of the device. These pins
do not physically connect to anything on the current device
revision. However, they should be externally connected to
Ground, if possible.
PQ/HQ208
BG225
P102
P104
P105
P107
P155
P156
P157
P158
P206
P207
P208
P51
P52
P53
P54
K8
H6
H7
H8
P1
P3
J7
J8
J9
PQ/HQ240
BG225
P143 ‡
P158 ‡
P204 ‡
P219 ‡
P22 ‡
P37 ‡
P83 ‡
P98 ‡
P195
H10
G7
G8
G9
H9
F8
4-109

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