MT29C4G48MAZAPAKD-5 IT Micron Technology Inc, MT29C4G48MAZAPAKD-5 IT Datasheet - Page 6

• Manufacturer Part Number: MT29C4G48MAZAPAKD-5 IT
• Description: MICMT29C4G48MAZAPAKD-5_IT 4G+2G MCP
• Manufacturer: Micron Technology Inc

List of Tables
Table 1: x8, x16 NAND Ball Descriptions ........................................................................................................ 13
Table 2: x32 LPDDR Ball Descriptions ............................................................................................................ 14
Table 3: Non-Device-Specific Descriptions .................................................................................................... 15
Table 4: Absolute Maximum Ratings .............................................................................................................. 16
Table 5: Recommended Operating Conditions ............................................................................................... 16
Table 6: Array Addressing – MT29F4G08 (x8) .................................................................................................. 25
Table 7: Array Addressing – MT29F4G16 (x16) ................................................................................................ 26
Table 8: Array Addressing – MT29F8G08 (x8) .................................................................................................. 27
Table 9: Array Addressing – MT29F8G16 ( x16) ............................................................................................... 28
Table 10: Asynchronous Interface Mode Selection .......................................................................................... 29
Table 11: Command Set ................................................................................................................................ 40
Table 12: Two-Plane Command Set ............................................................................................................... 41
Table 13: READ ID Parameters for Address 00h .............................................................................................. 45
Table 14: READ ID Parameters for Address 20h .............................................................................................. 46
Table 15: Parameter Page Data Structure ....................................................................................................... 48
Table 16: Feature Address Definitions ............................................................................................................ 52
Table 17: Feature Address 90h – Array Operation Mode .................................................................................. 53
Table 18: Feature Addresses 01h: Timing Mode .............................................................................................. 55
Table 19: Feature Addresses 80h: Programmable I/O Drive Strength ............................................................... 56
Table 20: Feature Addresses 81h: Programmable R/B# Pull-Down Strength ..................................................... 56
Table 21: Status Register Definition ............................................................................................................... 57
Table 22: Block Lock Address Cycle Assignments ............................................................................................ 88
Table 23: Block Lock Status Register Bit Definitions ........................................................................................ 91
Table 24: Error Management Details ............................................................................................................. 110
Table 25: Absolute Maximum Ratings ........................................................................................................... 114
Table 26: Recommended Operating Conditions ............................................................................................ 114
Table 27: Valid Blocks ................................................................................................................................... 114
Table 28: Capacitance .................................................................................................................................. 115
Table 29: Test Conditions ............................................................................................................................. 115
Table 30: DC Characteristics and Operating Conditions (3.3V) ....................................................................... 116
Table 31: DC Characteristics and Operating Conditions (1.8V) ....................................................................... 117
Table 32: AC Characteristics: Command, Data, and Address Input (3.3V) ........................................................ 118
Table 33: AC Characteristics: Command, Data, and Address Input (1.8V) ........................................................ 118
Table 34: AC Characteristics: Normal Operation (3.3V) .................................................................................. 119
Table 35: AC Characteristics: Normal Operation (1.8V) .................................................................................. 119
Table 36: Program/Erase Characteristics ....................................................................................................... 121
Table 37: Configuration Addressing – 2Gb ..................................................................................................... 134
Table 38: Absolute Maximum Ratings ........................................................................................................... 138
Table 39: AC/DC Electrical Characteristics and Operating Conditions ............................................................ 138
Table 40: Capacitance (x16, x32) ................................................................................................................... 140
Table 41: I
Table 42: I
Table 43: I
Table 44: I
Table 45: I
Table 46: Electrical Characteristics and Recommended AC Operating Conditions ........................................... 147
Table 47: Target Output Drive Characteristics (Full Strength) ......................................................................... 152
Table 48: Target Output Drive Characteristics (Three-Quarter Strength) ......................................................... 153
Table 49: Target Output Drive Characteristics (One-Half Strength) ................................................................ 154
Table 50: Truth Table – Commands .............................................................................................................. 156
PDF: 09005aef83ba4387
168ball_nand_lpddr_j42p_j4z2_j4z3_omap.pdf – Rev. H 3/11
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6 Specifications and Conditions ................................................................................................ 145
Specifications and Conditions, –40°C to +85°C (x16) .................................................................. 141
Specifications and Conditions, –40°C to +85°C (x32) .................................................................. 142
Specifications and Conditions, –40°C to +105°C (x16) ................................................................ 143
Specifications and Conditions, –40°C to +105°C (x32) ................................................................ 144
168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP
6
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