5535032-5 TE Connectivity, 5535032-5 Datasheet - Page 7

• Manufacturer Part Number: 5535032-5
• Description: ASSY,RECEPTACLE,EUROCARD,TYPE C,LEAD-FRE
• Manufacturer: TE Connectivity
• Series: 5535032 Seriesr
• Type: Type Cr

Specifications of 5535032-5

• Pitch Spacing: 2.54mm
• No. Of Contacts: 96
• Gender: Receptacle
• No. Of Rows: 3
• Rows Loaded: A + B + C
• Contact Termination: Through Hole
• Contact Material: Brass
• Contact Plating: Gold
• Approval: RoHS Compliant
• Number Of Rows: 3
• Number Of Positions / Contacts: 96
• Termination Style: Solder Pin
• Pitch: 2.54 mm
• Connector Type: Connector Assembly
• Pcb Mount Retention: With
• Pcb Mounting Orientation: Vertical
• Pcb Thickness (minimum) (mm [in]): 1.57 [0.062]
• Post Type: Compliant Post
• Size: Standard
• Make First / Break Last: No
• Bus Type: FUTUREBUS, MULTIBUS (II), NUBUS, VMEbus, VXIBus
• Din Level: II
• Mounting Ears: With
• Toolless (flat Rock): Yes
• Termination Post Length (mm [in]): 4.83 [0.190]
• Solder Tail Contact Plating: Tin
• Centerline (mm [in]): 2.54 [0.100]
• Number Of Positions: 96
• Pcb Mount Retention Type: Compliant Posts
• Contact Cross Section (mm [in]): 0.30 x 0.61 [.012 x .024]
• Contact Type: Socket
• Contact Base Material: Copper Alloy
• Contact Plating, Mating Area, Material: DIN 41612 Class 2
• Connector Style: Receptacle
• Housing Material: Polymer
• Ul Flammability Rating: UL 94V-0
• Flux-tight Coating: Without
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Applies To: Printed Circuit Board
• High Temperature Housing: No
• Lead Free Status / Rohs Status: Details

3.2. Housing Features
Surface Finish
HASL Sn Pb
Immersion Sn
OSP
Immersion Au/Ni
Immersion Ag
Rev G
Solder Tine Plated--Through
CONTACT
ACTION
TYPE
TYPE
PIN
C. Hole Dimensions
Values specified in the following must be complied with to ensure proper performance. The drilled hole
diameter and the copper plating thickness are of major importance and must be adhered to.
A. Boardlocks
The solder tine connectors are available with boardlocks which help retain the connector onto the pc
board. Special application tooling or equipment is not required for connectors with boardlocks.
B. Mounting Ears and Standoffs
These connectors are designed with mounting ears in different thicknesses and spacing between
standoffs. Those with larger mounting ear height and closer standoff spacing do not require a seating tool
to push the ACTION PIN contacts through the pc board holes to seat the connector. Those with smaller
mounting ear height and greater standoff spacing require the use of a seating tool. See Figure 4.
3.1.A.1 and .2 for PC
Refer to Paragraph
Board Thickness
Plated--Through
Plated--Through
Plated--Through
(Type Q)
TYPE
Non--
Thickness
0.008 [.0003] Min.
0.0005 [.000020] Min.
0.0002- - 0.0005 [.000008- - .000020]
0.004- - 0.005 Ni, 0.0001- - 0.0005 Au
[.00016- - .00020] Ni, [.000004- - .000020] Au
0.0001 [.000004] Min.
Finished Hole Dia.
After Plating
(Figure 3)
[.0443--.0463]
[.0344--.0364]
[.0443--.0463]
[.0443--.0463]
1.125--1.176
0.874--0.925
1.125--1.176
1.125--1.176
DRILLED
DIAMETER
PLATING (REF)
AFTER
[.040]
[.031]
[.039]
1.02
0.80
0.99
------
PC BOARD HOLE
Figure 3
(KNOOP- - 150 Max)
[.001- - .003]
[.001- - .003]
[.001- - .003]
0.03--0.08
0.03--0.08
0.03--0.08
COPPER
------
PLATING THICKNESS
See Surface Finish/Thickness
See Surface Finish/Thickness
See Surface Finish/Thickness
Callout in Above Illustration
Callout in Above Illustration
Drilled Hole Diameter
SURFACE
FINISH
------
Pad Diameter
Copper Plating
FR- - 4 Material (Ref)
PAD (MIN DIA)
PAD (MIN DIA)
Plus 0.51 [.020]
Hole Diameter
PC BOARD
1.57 [.062]
1.57 [.062]
1.65 [.065]
114- 9014
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