TSEV83102G0BGL E2V, TSEV83102G0BGL Datasheet - Page 32

• Manufacturer Part Number: TSEV83102G0BGL
• Manufacturer: E2V

Specifications of TSEV83102G0BGL

• Lead Free Status / RoHS Status: Not Compliant

Equivalent Input/Output Schematics
Figure 34. Equivalent Analog Input Circuit and ESD Protections
32
TS83102G0B
Package
Pins
VINB
VIN
(Bonding + Package + Ball)
Note:
Figure 35. Equivalent Clock Input Circuit and ESD Protections
Note:
Transmission Line
Transmission Line
Die Pads
Package + Ball)
50 Controlled
50 Controlled
Double Pad
Double Pad
Double Pad
(Bonding +
260 fF
260 fF
260 fF
MID
CLK
CLKB
100
100
GND
termination midpoint is located inside the package cavity and is DC coupled to ground.
termination midpoint is on-chip and AC coupled to ground through a 40 pF capacitor.
VEE = -5V
VEE = -5V
VEE = -5V
Double Pad
Double Pad
260 fF
260 fF
120 fF
120 fF
ESD
ESD
215 fF
ESD
VEE = -5V
VEE = -5V
Soldered into
Terminati o n
the Package
Resistors
Cavity
40 pF
ESD
120 fF
ESD
120 fF
50
50
150
150
1 mA
1 mA
400 µA
400 µA
2101D–BDC–06/04