IDT92HD81B1X5NLGXYCX8 IDT, Integrated Device Technology Inc, IDT92HD81B1X5NLGXYCX8 Datasheet - Page 285

• Manufacturer Part Number: IDT92HD81B1X5NLGXYCX8
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of IDT92HD81B1X5NLGXYCX8

• Lead Free Status / RoHS Status: Compliant

92HD81
SINGLE CHIP PC AUDIO SYSTEM, CODEC+SPEAKER AMPLIFIER+CAPLESS HP+LDO
©2009 INTEGRATED DEVICE TECHNOLOGY, INC.
IDT™ CONFIDENTIAL
9.2.
Time maintained above:
Time within 5
Standard Reflow Profile Data
Preheat:
Note: All temperatures refer to topside of the package, measured on the package body surface.
Peak / Classification Temperature (Tp)
Profile Feature
Note: These devices can be hand soldered at 360
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices” (www.jedec.org/download).
Average Ramp-Up Rate (Ts
o
C of actual Peak Temperature (tp)
Time 25
Temperature Max (Ts
Temperature Min (Ts
o
C to Peak Temperature
Time (ts
Temperature (T
Ramp-Down rate
Table 27. Standard Reflow Profile
Figure 16. Solder Reflow Profile
min
max
Time (t
- ts
- Tp)
max
max
min
L
L
)
)
)
)
)
3
150
200
60 - 180 seconds
217
60 - 150 seconds
See “Package Classification Reflow Temperatures”
20 - 40 seconds
6
8 minutes max
o
o
285
C / second max
C / second max
o
o
o
C
C
C
o
C for 3 to 5 seconds.
Pb Free Assembly
V 0.987 11/09
92HD81