ISP1504CBS,157 NXP Semiconductors, ISP1504CBS,157 Datasheet - Page 75
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ISP1504CBS,157
Manufacturer Part Number
ISP1504CBS,157
Description
RF Transceiver USB2.0 ULPI OTG
Manufacturer
NXP Semiconductors
Datasheet
1.ISP1504ABS118.pdf
(83 pages)
Specifications of ISP1504CBS,157
Number Of Transceivers
1
Esd Protection
YeskV
Operating Supply Voltage (typ)
Not RequiredV
Operating Temperature Classification
Industrial
Operating Supply Voltage (max)
Not RequiredV
Operating Supply Voltage (min)
Not RequiredV
Pin Count
32
Mounting
Surface Mount
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Operating Supply Voltage
1.65 V to 3.6 V
Mounting Style
SMD/SMT
Package / Case
HVQFN-32
Lead Free Status / RoHS Status
Compliant
Other names
935278309157 ISP1504CBS
NXP Semiconductors
ISP1504A_ISP1504C_3
Product data sheet
18.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 60.
Table 61.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 60
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
61
38.
Rev. 03 — 7 April 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
ISP1504A; ISP1504C
350 to 2000
260
250
245
38) than a SnPb process, thus
ULPI HS USB OTG transceiver
220
220
350
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
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