PIC32MX110F016B-I/SS Microchip Technology, PIC32MX110F016B-I/SS Datasheet - Page 246

• Manufacturer Part Number: PIC32MX110F016B-I/SS
• Description: PIC32, 16KB Flash, 4KB RAM, 40 MHz, CTMU, 4 DMA 28 SSOP .209in TUBE
• Manufacturer: Microchip Technology

PIC32MX1XX/2XX
29.1
TABLE 29-1:
TABLE 29-2:
TABLE 29-3:
DS61168C-page 246
DC5
DC5b
Industrial Temperature Devices
V-temp Temperature Devices
Power Dissipation:
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 28-pin SSOP
Package Thermal Resistance, 28-pin SOIC
Package Thermal Resistance, 28-pin SPDIP
Package Thermal Resistance, 28-pin QFN
Package Thermal Resistance, 36-pin VTLA
Package Thermal Resistance, 44-pin QFN
Package Thermal Resistance, 44-pin TQFP
Package Thermal Resistance, 44-pin VTLA
Note 1:
Characteristic
Operating Junction Temperature Range
Operating Junction Temperature Range
DC Characteristics
P
I/O = S (({V
Operating Ambient Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
OPERATING MIPS VS. VOLTAGE
DD
x (I
V
– V
DD
(in Volts)
DD
2.3-3.6V
2.3-3.6V
Characteristics
OH
– S I
Range
} x I
Rating
OH
OH
)
) + S (V
OL
x I
OL
-40°C to +105°C
Preliminary
-40°C to +85°C
Temp. Range
))
(in °C)
JA
(θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol Typical
P
DMAX
θ
θ
θ
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
JA
JA
JA
A
A
D
J
J
Min.
-40
-40
-40
-40
71
50
42
35
31
32
45
30
(T
PIC32MX1XX/2XX
P
© 2011 Microchip Technology Inc.
Max. Frequency
J
INT
Typical
– T
Max.
—
—
—
—
—
—
—
—
—
—
—
—
+ P
40 MHz
40 MHz
A
)/θ
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Max.
+125
+140
+105
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
1
1
1