D10850-40 Wakefield Thermal Solutions, D10850-40 Datasheet - Page 5
![HEATSINK 128PQFP COMPOSITE](/photos/5/91/59106/d10850-40_sml.jpg)
D10850-40
Manufacturer Part Number
D10850-40
Description
HEATSINK 128PQFP COMPOSITE
Manufacturer
Wakefield Thermal Solutions
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of D10850-40
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
21.60mm x 21.60mm
Height
0.4" (10.16mm)
Power Dissipation @ Temperature Rise
2W @ 80°C
Thermal Resistance @ Forced Air Flow
10°C/W @ 500 LFM
Product
Heatsinks
Mounting Style
Adhesive
Heatsink Material
Composite
Fin Style
Omnidirectional Pin
Dimensions
21.6 mm L x 21.6 mm W x 10.2 mm H
Designed For
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1077
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Notes:
Notes:
L L
G
L
G G
I