D10850-40 Wakefield Thermal Solutions, D10850-40 Datasheet - Page 18

• Manufacturer Part Number: D10850-40
• Description: HEATSINK 128PQFP COMPOSITE
• Manufacturer: Wakefield Thermal Solutions

Specifications of D10850-40

• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 21.60mm x 21.60mm
• Height: 0.4" (10.16mm)
• Power Dissipation @ Temperature Rise: 2W @ 80°C
• Thermal Resistance @ Forced Air Flow: 10°C/W @ 500 LFM
• Product: Heatsinks
• Mounting Style: Adhesive
• Heatsink Material: Composite
• Fin Style: Omnidirectional Pin
• Dimensions: 21.6 mm L x 21.6 mm W x 10.2 mm H
• Designed For: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1077

ROCKER CLIP OPTION
(SEE PRODUCT DES.)
SPRING CLIP OPTION
(SEE PRODUCT DES.)
2.34
OPTIONAL THERMAL INTERFACE
PAD (SEE PRODUCT DES.)
1.00
2.68
.23
1.50
.42
1.50
100 = 1.00"
MODEL NUMBER
HEIGHT
569 - 100 XX - XX
THERMAL INTERFACE
S4 = DELTALINK IV
BLANK = NO THERMAL PAD
CLIP
AK = SPRING CLIP
14-16 Pin DIPs