D10850-40 Wakefield Thermal Solutions, D10850-40 Datasheet - Page 12

HEATSINK 128PQFP COMPOSITE

D10850-40

Manufacturer Part Number
D10850-40
Description
HEATSINK 128PQFP COMPOSITE
Manufacturer
Wakefield Thermal Solutions
Datasheet

Specifications of D10850-40

Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
21.60mm x 21.60mm
Height
0.4" (10.16mm)
Power Dissipation @ Temperature Rise
2W @ 80°C
Thermal Resistance @ Forced Air Flow
10°C/W @ 500 LFM
Product
Heatsinks
Mounting Style
Adhesive
Heatsink Material
Composite
Fin Style
Omnidirectional Pin
Dimensions
21.6 mm L x 21.6 mm W x 10.2 mm H
Designed For
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1077
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
100
100
100
7
6
5
4
200
200
200
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
400
500
500
500
600
600
600
700
700
700
14
12
10
8
6
4
2
0
100
7
6
5
4
3
2
1
0
10
4
3
2
1
0
8
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
100
9
8
7
6
5
4
3
2
1
0
100
100
100
100
8
7
6
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
100
100
200
200
200
200
200
200
200
200
300
AIR VELOCITY (LFM)
300
300
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
604-40AB
604-60AB
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
300
610-35AB
610-40AB
400
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
400
400
400
614-30AB
400
400
500
500
500
500
500
500
500
500
600
600
600
600
600
600
600
600
700
700
700
700
700
700
700
700
8
6
4
2
0
100
7
6
5
4
3
2
1
0
10
100
9
8
7
6
5
4
3
2
1
0
100
8
7
6
5
4
3
2
8
7
6
5
4
3
2
100
100
200
2

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