D10850-40 Wakefield Thermal Solutions, D10850-40 Datasheet - Page 17
![HEATSINK 128PQFP COMPOSITE](/photos/5/91/59106/d10850-40_sml.jpg)
D10850-40
Manufacturer Part Number
D10850-40
Description
HEATSINK 128PQFP COMPOSITE
Manufacturer
Wakefield Thermal Solutions
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of D10850-40
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
21.60mm x 21.60mm
Height
0.4" (10.16mm)
Power Dissipation @ Temperature Rise
2W @ 80°C
Thermal Resistance @ Forced Air Flow
10°C/W @ 500 LFM
Product
Heatsinks
Mounting Style
Adhesive
Heatsink Material
Composite
Fin Style
Omnidirectional Pin
Dimensions
21.6 mm L x 21.6 mm W x 10.2 mm H
Designed For
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1077
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
8
7
6
5
4
3
2
1
0
3
2
1
0
5
4
3
2
1
0
100
100
100
200
200
200
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
400
500
500
500
600
600
600
700
700
700
3
2
1
0
3
2
1
0
3
2
1
0
3
2
1
0
5
4
3
2
1
0
100
100
100
100
100
7
6
5
4
3
2
1
0
100
200
200
200
200
200
200
300
300
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
AIR VELOCITY (LFM)
618-100AB
400
400
400
400
400
618-20AB
400
500
500
500
500
500
500
600
600
600
600
600
600
700
700
700
700
700
700