D10850-40 Wakefield Thermal Solutions, D10850-40 Datasheet - Page 2

• Manufacturer Part Number: D10850-40
• Description: HEATSINK 128PQFP COMPOSITE
• Manufacturer: Wakefield Thermal Solutions

Specifications of D10850-40

• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 21.60mm x 21.60mm
• Height: 0.4" (10.16mm)
• Power Dissipation @ Temperature Rise: 2W @ 80°C
• Thermal Resistance @ Forced Air Flow: 10°C/W @ 500 LFM
• Product: Heatsinks
• Mounting Style: Adhesive
• Heatsink Material: Composite
• Fin Style: Omnidirectional Pin
• Dimensions: 21.6 mm L x 21.6 mm W x 10.2 mm H
• Designed For: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1077

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
30
25
20
15
10
5
0
20
18
16
14
12
10
8
6
4
2
0
200
200
300
Approach Velocity, LFM
300
Approach Velocity, LFM
PRODUCT FEATURES
PRODUCT FEATURES
400
400
624-25-T4
624-35-T4
624-45-T4
624-60-T4
625-25-T4
625-25-T4
625-45-T4
625-60-T4
500
500
600
600