LTN20069-T5 Wakefield Thermal Solutions, LTN20069-T5 Datasheet
LTN20069-T5
Manufacturer Part Number
LTN20069-T5
Description
HEAT SINK BGA/PGA 16.5X16.5X8.9
Manufacturer
Wakefield Thermal Solutions
Datasheet
1.LTN20069-T5.pdf
(1 pages)
Specifications of LTN20069-T5
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Outline
16.51mm x 16.51mm
Height
0.35" (9mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Other names
345-1101
LTN20069
LTN20069-T5
LTN20069
LTN20069-T5