D10850-40 Wakefield Thermal Solutions, D10850-40 Datasheet - Page 13

• Manufacturer Part Number: D10850-40
• Description: HEATSINK 128PQFP COMPOSITE
• Manufacturer: Wakefield Thermal Solutions

Specifications of D10850-40

• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 21.60mm x 21.60mm
• Height: 0.4" (10.16mm)
• Power Dissipation @ Temperature Rise: 2W @ 80°C
• Thermal Resistance @ Forced Air Flow: 10°C/W @ 500 LFM
• Product: Heatsinks
• Mounting Style: Adhesive
• Heatsink Material: Composite
• Fin Style: Omnidirectional Pin
• Dimensions: 21.6 mm L x 21.6 mm W x 10.2 mm H
• Designed For: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1077

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
3
2
1
0
7
6
5
4
3
2
1
0
4
3
2
1
0
100
100
100
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
100
100
200
200
200
200
200
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
400
400
400
500
500
500
500
500
600
600
600
600
600
700
700
700
700
700
3
2
1
0
1