D10850-40 Wakefield Thermal Solutions, D10850-40 Datasheet - Page 3

• Manufacturer Part Number: D10850-40
• Description: HEATSINK 128PQFP COMPOSITE
• Manufacturer: Wakefield Thermal Solutions

Specifications of D10850-40

• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 21.60mm x 21.60mm
• Height: 0.4" (10.16mm)
• Power Dissipation @ Temperature Rise: 2W @ 80°C
• Thermal Resistance @ Forced Air Flow: 10°C/W @ 500 LFM
• Product: Heatsinks
• Mounting Style: Adhesive
• Heatsink Material: Composite
• Fin Style: Omnidirectional Pin
• Dimensions: 21.6 mm L x 21.6 mm W x 10.2 mm H
• Designed For: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1077

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
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