XC3SD3400A-4CSG484LI Xilinx Inc, XC3SD3400A-4CSG484LI Datasheet - Page 9

• Manufacturer Part Number: XC3SD3400A-4CSG484LI
• Description: FPGA Spartan®-3A Family 3.4M Gates 53712 Cells 667MHz 90nm Technology 1.2V 484-Pin BGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3A DSPr

Specifications of XC3SD3400A-4CSG484LI

• Package: 484BGA
• Family Name: Spartan®-3A
• Device Logic Units: 53712
• Device System Gates: 3400000
• Maximum Internal Frequency: 667 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 309
• Ram Bits: 2322432
• Package / Case: 484-CSBGA
• Mounting Type: Surface Mount
• Voltage - Supply: 1.1 V ~ 3.6 V
• Operating Temperature: -40°C ~ 100°C
• Number Of I /o: 309
• Number Of Logic Elements/cells: 5968
• Number Of Gates: 3400000
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

DS610 (v3.0) October 4, 2010
DC Electrical Characteristics
In this section, specifications may be designated as
Advance, Preliminary, or Production. These terms are
defined as follows:
Advance: Initial estimates are based on simulation, early
characterization, and/or extrapolation from the
characteristics of other families. Values are subject to
change. Use as estimates, not for production.
Preliminary: Based on characterization. Further changes
are not expected.
Production: These specifications are approved once the
silicon has been characterized over numerous production
lots. Parameter values are considered stable with no future
changes expected.
Table 3: Absolute Maximum Ratings
© Copyright 2007–2010 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. PCI and PCI-X are trademarks of PCI-SIG and used under license. All other trademarks are the property of their respective owners.
DS610 (v3.0) October 4, 2010
Product Specification
Notes:
1.
2.
Symbol
V
V
V
V
V
T
CCAUX
CCINT
V
CCO
I
T
STG
Upper clamp applies only when using PCI IOSTANDARDs.
For soldering guidelines, see UG112: Device Packaging and Thermal Characteristics and XAPP427: Implementation and Solder Reflow
Guidelines for Pb-Free Packages.
REF
ESD
IK
IN
J
Internal supply voltage
Auxiliary supply voltage
Output driver supply voltage
Input reference voltage
Voltage applied to all User I/O pins and
Dual-Purpose pins
Voltage applied to all Dedicated pins
Input clamp current per I/O pin
Electrostatic Discharge Voltage
Junction temperature
Storage temperature
Description
61
Driver in a high-impedance state
–0.5V < V
Human body model
Charged device model
Machine model
www.xilinx.com
IN
DC and Switching Characteristics
All parameter limits are representative of worst-case supply
voltage and junction temperature conditions. Unless
otherwise noted, the published parameter values apply
to all Spartan®-3A DSP devices. AC and DC
characteristics are specified using the same numbers
for both commercial and industrial grades.
Absolute Maximum Ratings
Stresses beyond those listed under
Maximum Ratings may cause permanent damage to the
device. These are stress ratings only; functional operation
of the device at these or any other conditions beyond those
listed under the Recommended Operating Conditions is not
implied. Exposure to absolute maximum conditions for
extended periods of time adversely affects device reliability.
< (V
Conditions
CCO
Spartan-3A DSP FPGA Family:
+ 0.5V)
(1)
–0.95
–0.5
–0.5
–0.5
–0.5
–0.5
Min
–65
–
–
–
–
–
Product Specification
Table
V
CCO
±2000
±100
±500
±200
Max
1.32
3.75
3.75
125
150
4.6
4.6
3: Absolute
+ 0.5
Units
mA
°C
°C
V
V
V
V
V
V
V
V
V
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