XC3S200AN-4FT256C Xilinx Inc, XC3S200AN-4FT256C Datasheet - Page 77
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XC3S200AN-4FT256C
Manufacturer Part Number
XC3S200AN-4FT256C
Description
FPGA Spartan®-3AN Family 200K Gates 4032 Cells 667MHz 90nm Technology 1.2V 256-Pin FTBGA
Manufacturer
Xilinx Inc
Datasheet
1.XC3S50AN-4TQG144C.pdf
(123 pages)
Specifications of XC3S200AN-4FT256C
Package
256FTBGA
Family Name
Spartan®-3AN
Device Logic Units
4032
Device System Gates
200000
Maximum Internal Frequency
667 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
195
Ram Bits
294912
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S200AN-4FT256C
Manufacturer:
XILINX
Quantity:
302
Company:
Part Number:
XC3S200AN-4FT256C
Manufacturer:
Xilinx Inc
Quantity:
10 000
User I/Os by Bank
Table 69
The AWAKE pin is counted as a dual-purpose I/O.
Table 69: User I/Os Per Bank for the XC3S50AN in the TQG144 Package
Footprint Migration Differences
The XC3S50AN FPGA is the only Spartan-3AN device offered in the TQG144 package. The XC3S50AN FPGA is pin
compatible with the Spartan-3A XC3S50A FPGA in the TQ(G)144 package, although the Spartan-3A FPGA requires an
external configuration source.
DS557 (v4.1) April 1, 2011
Product Specification
Top
Right
Bottom
Left
Package
Edge
Total
indicates how the 108 available user-I/O pins are distributed between the four I/O banks on the TQG144 package.
I/O Bank
0
1
2
3
Maximum I/Os
108
27
25
30
26
I/O
14
11
15
42
2
www.xilinx.com
INPUT
1
0
0
1
2
All Possible I/O Pins by Type
Spartan-3AN FPGA Family: Pinout Descriptions
DUAL
21
26
1
4
0
VREF
3
2
1
2
8
CLK
30
8
8
6
8
77