MT48H8M32LFB5-75 IT:H Micron Technology Inc, MT48H8M32LFB5-75 IT:H Datasheet - Page 58

• Manufacturer Part Number: MT48H8M32LFB5-75 IT:H
• Description: DRAM Chip Mobile SDRAM 256M-Bit 8Mx32 1.8V 90-Pin VFBGA Tray
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H8M32LFB5-75 IT:H

• Density: 256 Mb
• Maximum Clock Rate: 133 MHz
• Package: 90VFBGA
• Address Bus Width: 14 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Random Access Time: 8|6 ns
• Operating Temperature: -40 to 85 °C
• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 256M (8Mx32)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Package / Case: 90-VFBGA
• Organization: 8Mx32
• Address Bus: 14b
• Access Time (max): 8/6ns
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 100mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 38:
PDF:09005aef8219eeeb/Source: 09005aef8219eedd
256mb_x16_sdram_y36m_1.fm - Rev G 6/09 EN
COMMAND
BA[1:0]
ADDR
DQM
CLK
CKE
A10
Self Refresh Mode
DQ
Precharge all
t CKS
active banks
t CMS
SINGLE BANK
t
AS
PRECHARGE
ALL BANKS
BANK(S)
T0
t CKH
High-Z
t CMH
t
AH
t CK
t RP
T1
NOP
t CH
Enter self refresh mode
t CKS
t CL
REFRESH
AUTO
CLK stable prior to exiting
T2
self refresh mode
> t RAS
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(Restart refresh time base)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Exit self refresh mode
Tn + 1
NOP
256Mb: x16, x32 Mobile SDRAM
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To + 1
©2006 Micron Technology, Inc. All rights reserved.
To + 2
Timing Diagrams
REFRESH
AUTO
DON’T CARE