MT47H32M16HR-3 IT:F TR Micron Technology Inc, MT47H32M16HR-3 IT:F TR Datasheet - Page 98
![DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA T/R](/photos/31/34/313419/mfg557-84-fbga_sml.jpg)
MT47H32M16HR-3 IT:F TR
Manufacturer Part Number
MT47H32M16HR-3 IT:F TR
Description
DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA T/R
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Specifications of MT47H32M16HR-3 IT:F TR
Density
512 Mb
Maximum Clock Rate
667 MHz
Package
84FBGA
Address Bus Width
15 Bit
Operating Supply Voltage
1.8 V
Maximum Random Access Time
0.45 ns
Operating Temperature
-40 to 85 °C
Organization
32Mx16
Address Bus
15b
Access Time (max)
450ps
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
250mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
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Figure 51: Bank Read – Without Auto Precharge
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
Bank address
Case 1: t AC (MIN) and t DQSCK (MIN)
DQS, DQS#
DQS, DQS#
Command
Case 2: t AC (MAX) and t DQSCK (MAX)
Address
DQ 8
DQ 8
CK#
CKE
A10
DM
CK
NOP 1
T0
Notes:
Bank x
ACT
RA
RA
T1
1. NOP commands are shown for ease of illustration; other commands may be valid at
2. BL = 4 and AL = 0 in the case shown.
3. The PRECHARGE command can only be applied at T6 if
4. READ-to-PRECHARGE = AL + BL/2 - 2CK + MAX (
5. Disable auto precharge.
6. “Don’t Care” if A10 is HIGH at T5.
7. I/O balls, when entering or exiting High-Z, are not referenced to a specific voltage level,
8. DO n = data-out from column n; subsequent elements are applied in the programmed
these times.
but to when the device begins to drive or no longer drives, respectively.
order.
t CK
t RAS 3
t RCD
t RC
NOP 1
T2
t CH
t CL
NOP 1
T3
Bank x
READ 2
5
Col n
98
T4
CL = 3
t RTP 4
NOP 1
T5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t LZ (MIN)
t LZ (MAX)
512Mb: x4, x8, x16 DDR2 SDRAM
One bank
All banks
Bank x 6
7
PRE 3
T6
7
t
t RPRE
RTP/
t LZ (MIN)
t LZ (MIN)
t RPRE
t
Transitioning Data
CK or 2CK).
t
NOP 1
RAS (MIN) is met.
T7
t DQSCK (MAX)
t DQSCK (MIN)
t RP
DO
n
t AC (MIN)
t AC (MAX)
DO
© 2004 Micron Technology, Inc. All rights reserved.
n
T7n
NOP 1
T8
t HZ (MIN)
t HZ (MAX)
T8n
t RPST
Don’t Care
t RPST
Bank x
ACT
RA
T9
7
RA
7
READ
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