MT47H32M16HR-3 IT:F TR Micron Technology Inc, MT47H32M16HR-3 IT:F TR Datasheet - Page 92

• Manufacturer Part Number: MT47H32M16HR-3 IT:F TR
• Description: DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA T/R
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M16HR-3 IT:F TR

• Density: 512 Mb
• Maximum Clock Rate: 667 MHz
• Package: 84FBGA
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Random Access Time: 0.45 ns
• Operating Temperature: -40 to 85 °C
• Organization: 32Mx16
• Address Bus: 15b
• Access Time (max): 450ps
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 250mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Figure 44: READ Latency
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
Notes:
DQS, DQS#
DQS, DQS#
DQS, DQS#
Command
Command
Command
Address
Address
Address
1. DO n = data-out from column n.
2. BL = 4.
3. Three subsequent elements of data-out appear in the programmed order following
4. Shown with nominal
CK#
CK#
CK#
DQ
DQ
DQ
CK
CK
CK
DO n.
Bank a,
Bank a,
Bank a,
READ
READ
READ
Col n
Col n
Col n
T0
T0
T0
AL = 1
RL = 3 (AL = 0, CL = 3)
NOP
NOP
NOP
T1
T1
T1
t
AC,
RL = 4 (AL = 1 + CL = 3)
RL = 4 (AL = 0, CL = 4)
92
t
DQSCK, and
NOP
NOP
NOP
T2
T2
T2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
CL = 3
t
DQSQ.
512Mb: x4, x8, x16 DDR2 SDRAM
NOP
NOP
NOP
T3
T3
T3
DO
n
T3n
T3n
Transitioning Data
NOP
NOP
NOP
T4
T4
T4
© 2004 Micron Technology, Inc. All rights reserved.
DO
DO
n
n
T4n
T4n
T4n
T5
NOP
NOP
T5
NOP
T5
Don’t Care
T5n
READ