MT47H32M16HR-3 IT:F TR Micron Technology Inc, MT47H32M16HR-3 IT:F TR Datasheet - Page 106
![DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA T/R](/photos/31/34/313419/mfg557-84-fbga_sml.jpg)
MT47H32M16HR-3 IT:F TR
Manufacturer Part Number
MT47H32M16HR-3 IT:F TR
Description
DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA T/R
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Specifications of MT47H32M16HR-3 IT:F TR
Density
512 Mb
Maximum Clock Rate
667 MHz
Package
84FBGA
Address Bus Width
15 Bit
Operating Supply Voltage
1.8 V
Maximum Random Access Time
0.45 ns
Operating Temperature
-40 to 85 °C
Organization
32Mx16
Address Bus
15b
Access Time (max)
450ps
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
250mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
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Figure 59: WRITE Interrupted by WRITE
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
DQS, DQS#
Command
Address
CK#
A10
DQ
CK
WRITE 1 a
Valid 5
T0
2-clock requirement
Notes:
NOP 2
T1
WL = 3
1. BL = 8 required and auto precharge must be disabled (A10 = LOW).
2. The NOP or COMMAND INHIBIT commands are valid. The PRECHARGE command cannot
3. The interrupting WRITE command must be issued exactly 2 ×
4. The earliest WRITE-to-PRECHARGE timing for WRITE at T0 is WL + BL/2 +
5. The WRITE command can be issued to any valid bank and row address (WRITE command
6. Auto precharge can be either enabled (A10 = HIGH) or disabled (A10 = LOW) by the in-
7. Subsequent rising DQS signals must align to the clock within
8. Example shown uses AL = 0; CL = 4, BL = 8.
be issued to banks used for WRITEs at T0 and T2.
starts with T7 and not T5 (because BL = 8 from MR and not the truncated length).
at T0 and T2 can be either same bank or different bank).
terrupting WRITE command.
WRITE 3 b
Valid 6
Valid 5
T2
NOP 2
T3
DI
a
WL = 3
a + 1
DI
NOP 2
a + 2
T4
7
DI
106
a + 3
DI
NOP 2
T5
DI
b
7
Micron Technology, Inc. reserves the right to change products or specifications without notice.
b + 1
512Mb: x4, x8, x16 DDR2 SDRAM
DI
NOP 2
b + 2
T6
DI
7
b + 3
DI
Valid 4
b + 4
T7
DI
7
Transitioning Data
© 2004 Micron Technology, Inc. All rights reserved.
t
t
b + 5
DQSS.
CK from previous WRITE.
DI
Valid 4
b + 6
T8
DI
7
b + 7
t
DI
WR where
Valid 4
Don’t Care
T9
WRITE
t
WR
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