MT47H32M16HR-3 IT:F TR Micron Technology Inc, MT47H32M16HR-3 IT:F TR Datasheet - Page 4

• Manufacturer Part Number: MT47H32M16HR-3 IT:F TR
• Description: DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA T/R
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M16HR-3 IT:F TR

• Density: 512 Mb
• Maximum Clock Rate: 667 MHz
• Package: 84FBGA
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Random Access Time: 0.45 ns
• Operating Temperature: -40 to 85 °C
• Organization: 32Mx16
• Address Bus: 15b
• Access Time (max): 450ps
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 250mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Contents
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Functional Block Diagrams ............................................................................................................................. 12
Ball Assignments and Descriptions ................................................................................................................. 14
Packaging ...................................................................................................................................................... 18
Electrical Specifications – Absolute Ratings ..................................................................................................... 21
Electrical Specifications – I
AC Timing Operating Specifications ................................................................................................................ 31
AC and DC Operating Conditions .................................................................................................................... 42
ODT DC Electrical Characteristics ................................................................................................................... 43
Input Electrical Characteristics and Operating Conditions ............................................................................... 44
Output Electrical Characteristics and Operating Conditions ............................................................................. 47
Output Driver Characteristics ......................................................................................................................... 49
Power and Ground Clamp Characteristics ....................................................................................................... 53
AC Overshoot/Undershoot Specification ......................................................................................................... 54
Input Slew Rate Derating ................................................................................................................................ 56
Commands .................................................................................................................................................... 69
Mode Register (MR) ........................................................................................................................................ 75
Extended Mode Register (EMR) ....................................................................................................................... 80
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
Industrial Temperature .............................................................................................................................. 10
Automotive Temperature ........................................................................................................................... 11
General Notes ............................................................................................................................................ 11
Package Dimensions .................................................................................................................................. 18
FBGA Package Capacitance ......................................................................................................................... 20
Temperature and Thermal Impedance ........................................................................................................ 21
I
I
Truth Tables ............................................................................................................................................... 69
DESELECT ................................................................................................................................................. 73
NO OPERATION (NOP) .............................................................................................................................. 74
LOAD MODE (LM) ..................................................................................................................................... 74
ACTIVATE .................................................................................................................................................. 74
READ ......................................................................................................................................................... 74
WRITE ....................................................................................................................................................... 74
PRECHARGE .............................................................................................................................................. 75
REFRESH ................................................................................................................................................... 75
SELF REFRESH ........................................................................................................................................... 75
Burst Length .............................................................................................................................................. 76
Burst Type ................................................................................................................................................. 77
Operating Mode ......................................................................................................................................... 77
DLL RESET ................................................................................................................................................. 77
Write Recovery ........................................................................................................................................... 78
Power-Down Mode .................................................................................................................................... 78
CAS Latency (CL) ........................................................................................................................................ 79
DLL Enable/Disable ................................................................................................................................... 81
Output Drive Strength ................................................................................................................................ 81
DQS# Enable/Disable ................................................................................................................................. 81
RDQS Enable/Disable ................................................................................................................................. 81
Output Enable/Disable ............................................................................................................................... 81
On-Die Termination (ODT) ........................................................................................................................ 82
DD
DD7
Specifications and Conditions ............................................................................................................... 24
Conditions .......................................................................................................................................... 24
DD
Parameters ........................................................................................................ 24
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
© 2004 Micron Technology, Inc. All rights reserved.
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