COM20022I3V-HD SMSC, COM20022I3V-HD Datasheet - Page 79

• Manufacturer Part Number: COM20022I3V-HD
• Description: Network Controller & Processor ICs ARCNET Contrllr
• Manufacturer: SMSC

Specifications of COM20022I3V-HD

• Data Rate: 10 Mbps
• Supply Voltage (max): 3.465 V
• Supply Voltage (min): 3.135 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Package / Case: TQFP-48
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10 Mbps ARCNET (ANSI 878.1) Controller with 2Kx8 On-Board RAM
Datasheet
Notes:
1)
2)
3)
4)
5)
SMSC COM20022I 3V
Controlling Unit: millimeter
Tolerance on the position of the leads is ± 0.04 mm maximum.
Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm.
Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-1.08 mm.
Details of pin 1 identifier are optional but must be located within the zone indicated.
ccc
ccc
D/2
E/2
A1
A2
D1
R1
R2
E1
L1
W
A
D
E
H
L
e
θ
MIN
0.05
1.35
8.80
4.40
6.90
8.80
4.40
6.90
0.09
0.45
0.17
0.08
0.08
0
~
~
~
~
o
0.50 Basic
NOMINAL
Table 8.2 - 48 Pin TQFP Package Parameters
Figure 8.19 - 48 Pin TQFP Package Outline
0.10
1.40
9.00
4.50
7.00
9.00
4.50
7.00
0.60
1.00
~
~
~
~
~
~
~
~
DATASHEET
0.0762
MAX
0.15
1.45
9.20
4.60
7.10
9.10
4.60
7.10
0.20
0.75
0.27
0.20
0.08
1.6
7
~
~
o
Page 79
1
1
/
/
Lead Foot Length from Centerline
2
2
X Span Measure from Centerline
Y Span Measure from Centerline
Coplanarity (Assemblers)
Coplanarity (Test House)
Overall Package Height
Lead Frame Thickness
Lead Shoulder Radius
Lead Foot Radius
Lead Foot Angle
Body Thickness
Lead Length
X body Size
Y body Size
Lead Width
Lead Pitch
REMARK
Standoff
X Span
Y Span
Revision 02-27-06