FDMA6023PZT Fairchild Semiconductor, FDMA6023PZT Datasheet - Page 3

• Manufacturer Part Number: FDMA6023PZT
• Description: MOSFET P-CH DUAL 20V 6MICROFET
• Manufacturer: Fairchild Semiconductor
• Series: PowerTrench®r

Specifications of FDMA6023PZT

• Fet Type: 2 P-Channel (Dual)
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 60 mOhm @ 3.6A, 4.5V
• Drain To Source Voltage (vdss): 20V
• Current - Continuous Drain (id) @ 25° C: 3.6A
• Vgs(th) (max) @ Id: 1.5V @ 250µA
• Gate Charge (qg) @ Vgs: 17nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 885pF @ 10V
• Power - Max: 700mW
• Mounting Type: Surface Mount
• Package / Case: 6-UMLP, 6-MicroFET™
• Configuration: Dual
• Transistor Polarity: P-Channel
• Resistance Drain-source Rds (on): 0.06 Ohm @ 4.5 V
• Drain-source Breakdown Voltage: 20 V
• Gate-source Breakdown Voltage: +/- 8 V
• Continuous Drain Current: 3.6 A
• Power Dissipation: 1400 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 55 C
• Module Configuration: Dual
• Continuous Drain Current Id: -3.6A
• Drain Source Voltage Vds: -20V
• On Resistance Rds(on): 60mohm
• Rds(on) Test Voltage Vgs: -4.5V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: FDMA6023PZTTR

©2009 Fairchild Semiconductor Corporation
FDMA6023PZT Rev.B1
Electrical Characteristics
Notes:
1. R
2. Pulse Test: Pulse Width < 300 µs, Duty cycle < 2.0%.
3. The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied.
user's board design.
θJA
(a) R
(b) R
(c) R
(d) R
is determined with the device mounted on a 1 in
θJA
θJA
θJA
θJA
= 86 °C/W when mounted on a 1 in
= 69 °C/Wwhen mounted on a 1 in
= 173 °C/W when mounted on a minimum pad of 2 oz copper. For single operation.
= 151 °C/W when mounted on a minimum pad of 2 oz copper. For dual operation.
a) 86
mounted on a
1in
copper.
2
pad of 2 oz
o
C/W when
2
2
pad of 2 oz copper, 1.5 " x 1.5 " x 0.062 " thick PCB. For dual operation.
pad of 2 oz copper, 1.5 " x 1.5 " x 0.062 " thick PCB. For single operation.
T
2
J
oz. copper pad on a 1.5 x 1.5 in. board of FR-4 material. R
= 25 °C unless otherwise noted
b)173
when mounted
on a minimum
pad of 2 oz
copper.
o
C/W
3
θJC
c) 69
mounted on a
1in
copper.
is guaranteed by design while R
2
pad of 2 oz
o
C/W when
θJA
is determined by the
www.fairchildsemi.com
d)151
when mounted
on a minimum
pad of 2 oz
copper.
o
C/W