CYIH1SM1000AA-HHCS Cypress Semiconductor Corp, CYIH1SM1000AA-HHCS Datasheet - Page 6

• Manufacturer Part Number: CYIH1SM1000AA-HHCS
• Description: IC SPACE IMAGE SENSOR 84-JLCC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CYIH1SM1000AA-HHCS

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

5.9.3 Package lot acceptance
5 packages shall be chosen randomly from the lot and will be
measured in detail. All obtained results will be compared with
Figure 2
5.9.4 Assembly Lot Acceptance
Before and after the following tests are done:
■
■
■
Fine- and gross-leak tests shall be performed using the following methods:
Fine Leak test: MIL-STD-883, Test Method 1014, Condition A
Gross Leak test: MIL-STD-883, Test Method 1014, Condition C
The required leak rate for fine leak testing is 5·10-7 atms. cm3/s
Document Number: 001-54123 Rev. *A
Special assembly house in
process control
Bond strength test
Assembly House Geometrical
data review
Solder ability
Terminal strength
Marking permanence
Geometrical measurements
Temperature cycling
Moisture resistance
DPA:
Die shear test
Bond pull test
Electrical measurements conform
Detailed visual inspection
Fine leak test + Gross leak test
on page 25.
Test
MIL-STD-883 method 2011
Review
MIL-STD883, method 2003
MIL-STD 883, method 2004
ESCC 24800
PID
MIL-STD 883, method 1010
MIL-STD-883 method 2019
MIL-STD-883 method 2011
JEDEC Std. Method A101-B
Table 4
on page 14 of this specification
Test method
A solderability test is covered in the assembly lot acceptance
tests
Number of
(Table
devices
All
All
2
3
5
4
5.9.4).
D
D
Condition B
50 cycles
-55°C/+125°C
240h at 85°C/85%
N/A
All wires
Test condition
CYIH1SM1000AA-HHCS
Assembly House
CY
Test House
CY
Test House
Test House
Test House
Test House
Assembly House
Test location
Page 6 of 71
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