DSPIC33EP512MU810T-I/PT Microchip Technology, DSPIC33EP512MU810T-I/PT Datasheet - Page 460

• Manufacturer Part Number: DSPIC33EP512MU810T-I/PT
• Description: 100 PINS, 512KB Flash, 52KB RAM, 60 MHz, USB, 2xCAN, 15 DMA 100 TQFP 12x12x1mm T
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33EPr

Specifications of DSPIC33EP512MU810T-I/PT

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, QEI, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 83
• Program Memory Size: 512KB (170K x 24)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 24K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC33EPXXXMU806/810/814 and PIC24EPXXXGU810/814
32.1
TABLE 32-1:
TABLE 32-2:
TABLE 32-3:
DS70616E-page 460
Characteristic
Note 1:
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 64-pin QFN (9x9 mm)
Package Thermal Resistance, 64-pin TQFP (10x10 mm)
Package Thermal Resistance, 100-pin TQFP (12x12 mm)
Package Thermal Resistance, 100-pin TQFP (14x14 mm)
Package Thermal Resistance, 121-pin XBGA (10x10 mm)
Package Thermal Resistance, 144-pin LQFP (20x20 mm)
Package Thermal Resistance, 144-pin TQFP (16x16 mm)
Note 1:
—
—
DC Characteristics
P
I/O =  ({V
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
See the BO10 parameter in
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
V
V
– V
V
DD
BOR
(in Volts)
BOR
DD
OH
Characteristic
–  I
Range
-3.6V
-3.6V
} x I
Rating
OH
OH
(1)
(1)
)
) +  (V
Table 32-11
OL
x I
OL
-40°C to +125°C
)
Preliminary
-40°C to +85°C
Temp Range
for the minimum and maximum BOR values.
(in °C)
JA
(

JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX







P
T
T
T
T
JA
JA
JA
JA
JA
JA
JA
A
A
D
J
J
dsPIC33EPXXXMU806/810/814 and
Min.
Typ.
-40
-40
-40
-40
28
47
43
43
40
33
33
 2009-2011 Microchip Technology Inc.
PIC24EPXXXGU810/814
(T
P
Maximum MIPS
INT
J
– T
Max.
Typ.
—
—
—
—
—
—
—
—
—
—
—
+ P
A
)/
60
60
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Max.
+125
+140
+125
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
1
1